Electro-optic device and electronic apparatus

ABSTRACT

An electro-optic device includes: a liquid crystal panel which includes an element substrate, a facing substrate arranged so as to face the element substrate with a sealing material interposed therebetween, and a liquid crystal layer sealed in a region surrounded by the sealing material; and a mold which covers an outer circumference of the liquid crystal panel and functions as a mold, in which the mold covers a region, which is overlapped with at least a part of the sealing material in a plan view, from an end of the element substrate and an end of the facing substrate on a surface of the element substrate on an opposite side to the liquid crystal layer and a surface of the facing substrate on an opposite side to the liquid crystal layer, and in which a surface of the mold has liquid repellency.

BACKGROUND

1. Technical Field

The present invention relates to an electro-optic device and anelectronic apparatus.

2. Related Art

As an electronic apparatus, an active drive-type liquid crystal devicewhich includes, for each pixel, a transistor as an element for switchingcontrol of a pixel electrode, for example, is known. The liquid crystaldevice is used in a direct-view-type display or a light valve, forexample.

The liquid crystal device includes a liquid crystal panel in which asealing material is disposed at a peripheral edge portion between a pairof substrates and a liquid crystal layer is sealed in a space surroundedby the sealing material. Furthermore, the liquid crystal panel isaccommodated in a frame and is fixed with an adhesive agent between theliquid crystal panel and the frame. According to such a liquid crystaldevice, there is a case where moisture enters the liquid crystal layervia the sealing member, which brings about deterioration in displayquality or a decrease in lifetime of the liquid crystal layer.

For example, JP-A-2007-65619 thus discloses a method of reducing entryof moisture into the liquid crystal layer by providing a mold materialon an outer circumferential side of the sealing material.

However, a further improvement in quality has been required with alonger lifetime and higher definition of the liquid crystal device, andthe method disclosed in JP-A-2007-65619 has a problem in that moistureresistance is not sufficient.

SUMMARY

The present invention can be realized in the following forms orapplication examples.

Application Example 1

According to this application example, there is provided anelectro-optic device according to this application example including: anelectro-optic panel which includes a first substrate, a second substratearranged so as to face the first substrate with a sealing materialinterposed therebetween, and an electro-optic layer sealed in a regionsurrounded by the sealing material; and a mold which covers an outercircumference of the electro-optic panel and functions as a frame, inwhich the mold covers a region, which is overlapped with at least a partof the sealing material in a plan view, from an end of the firstsubstrate and an end of the second substrate on a surface of the firstsubstrate on an opposite side to the electro-optic layer and a surfaceof the second substrate on an opposite side to the electro-optic layer,and in which a surface of the mold has liquid repellency.

Since the mold covers the region from the sealing material pinchedbetween the pair of substrates, namely the first substrate and thesecond substrate to the surfaces of the substrates on the opposite sideto the sealing material in this application example, it is possible toextend a length of an interface between the substrates and the mold.Accordingly, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material.

Application Example 2

In the electro-optic device according to the above application example,it is preferable that a coating agent with liquid repellency be arrangedon the surface of the mold.

Since the coating agent is provided on the surface of the mold in thisapplication example, it is possible to suppress transmittance ofmoisture through the mold and entry of the moisture into theelectro-optic layer.

Application Example 3

In the electro-optic device according to the above application example,it is preferable that a light-blocking hook which includes an openinghole overlapped with a display region surrounded by the mold be providedso as to be in contact with the mold.

Since the light-blocking hook is arranged so as to surround the displayregion in this application example, it is possible to limit a range oflight which is incident on the display region.

Application Example 4

In the electro-optic device according to the above application example,it is preferable that a frame body be provided so as to be in directcontact with the first substrate or the second substrate or in indirectcontact with the first substrate or the second substrate via a thirdsubstrate.

Since the frame body is arranged so as to be in direct or indirectcontact with the first substrate or the second substrate in thisapplication example, it is possible to release heat of the substrates(electro-optic panel) via the frame body.

Application Example 5

According to this application example, there is provided a method ofmanufacturing an electro-optic device including: arranging a lower molddie in a circumference of an electro-optic panel which includes a firstsubstrate, a second substrate arranged so as to face the first substratewith a sealing material interposed therebetween and an electro-opticlayer arranged between the first substrate and the second substrate;arranging an upper mold die on the electro-optic panel, and forming amold in an outer circumference of the electro-optic panel by supplyingsoftened resin to the lower mold die.

Since the mold is formed in the outer circumference of the electro-opticpanel by using the upper mold die and the lower mold die in thisapplication example, it is possible to extend the length of theinterface between the substrates and the mold from the sealing materialwhich is pinched between the pair of substrates, namely the firstsubstrate and the second substrate to the surfaces of the substrates onthe opposite side to the sealing material. Accordingly, it is possibleto suppress entry of moisture into the electro-optic layer via theinterface and the sealing material.

Application Example 6

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further includeperforming coating processing on the surface of the mold to provideliquid repellency thereto after forming the mold.

Since the coating processing is performed on the mold in thisapplication example, it is possible to suppress transmittance ofmoisture through the mold and entry of the moisture into theelectro-optic layer.

Application Example 7

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include formingTeflon (registered trademark) on surfaces of the upper mold die and thelower mold die.

Since Teflon is formed on the mold dies in this application example, itis possible to facilitate separation of the mold, which is supplied tothe mold dies, from the mold dies.

Application Example 8

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include fixing alight-blocking hook, which includes an opening hole in a display regionsurrounded by the mold in the electro-optic panel, to the mold.

Since the light-blocking hook which includes an opening hole in thedisplay region is fixed to the mold in this application example, it ispossible to limit the range of the light which is incident on thedisplay region.

Application Example 9

In the method of manufacturing an electro-optic device according to theabove application method, it is preferable to further include fixing aframe body to the mold so as to be in direct contact with the firstsubstrate or the second substrate or in indirect contact with the firstsubstrate or the second substrate via a third substrate.

Since the frame body is fixed so as to be in direct or indirect contactwith the first substrate or the second substrate in this applicationexample, it is possible to release the heat of the substrates(electro-optic panel) via the frame body.

Application Example 10

According to this application example, there is provided an electronicapparatus including the electro-optic device as described in the aboveapplication examples.

Since the electronic apparatus includes the electro-optic device asdescribed in the above application examples according to thisapplication example, it is possible to supply an electronic apparatuscapable of improving display quality and suppressing deterioration inthe electro-optic layer.

Application Example 11

According to this application example, there is provided anelectro-optic device including: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; a mold which covers an outer circumference of theelectro-optic panel and functions as a frame; a first hook which isarranged between the first substrate and the mold, includes an openingoverlapped with a display region of the electro-optic panel, and blockslight; and a second hook which is arranged between the second substrateand the mold, includes an opening overlapped with the display region,and blocks light, in which the mold covers a region, which is overlappedwith at least a part of the sealing material in a plan view, from an endof the first hook and an end of the second hook on a surface of thefirst hook and a surface of the second hook.

Since the mold covers the region from the sealing material which ispinched between the pair of substrates, namely the first substrate andthe second substrate to the surface of the first hook at the firstsubstrate on the opposite side to the sealing material and the surfaceof the second hook at the second substrate on the opposite side to thesealing material in this application example, it is possible to extendthe length of the interface between the substrates and the mold.Accordingly, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material.

In addition, since the first hook and the second hook made of a metalmaterial are arranged so as to be in contact with the electro-opticpanel, it is possible to release heat accumulated in the electro-opticpanel. Moreover, since the hooks with a parting function are arrangednear the electro-optic panel, it is possible to improve partingaccuracy.

Application Example 12

In the electro-optic device according to the above application example,it is preferable that a coating agent with liquid repellency be arrangedon the surface of the mold.

Since the coating agent is provided on the surface of the mold in thisapplication example, it is possible to suppress transmittance ofmoisture through the mold and entry of the moisture into theelectro-optic layer.

Application Example 13

In the electro-optic device according to the above application example,it is preferable to further include a third hook which is arranged so asto be in contact with a surface of the mold, includes an openingoverlapped with the display region, and blocks light.

Since the light-blocking third hook is arranged so as to surround thedisplay region in this application example, it is possible to limit therange of the light, which is incident on the display region, along withthe first hook and the second hook.

Application Example 14

In the electro-optic device according to the above application example,it is preferable that a third substrate be provided between the firstsubstrate and the first hook and between the second substrate and thesecond hook.

Since the third panel (a dust proofing glass, for example) is providedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the third substrate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus, for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 15

In the electro-optic device according to the above application example,it is preferable that a frame body be provided so as to be in contactwith the first hook or the second hook.

Since the frame body is arranged so as to be in contact with the firsthook or the second hook, it is possible to release the heat of thesubstrates (electro-optic panel) via the first hook, the second hook,and the frame body.

Application Example 16

According to this application example, there is provided a method ofmanufacturing an electro-optic device, the electro-optic deviceincluding an electro-optic panel including a first substrate, a secondsubstrate arranged so as to face the first substrate with a sealingmaterial interposed therebetween, and an electro-optic layer arrangedbetween the first substrate and the second substrate, the methodincluding: arranging a first hook, which includes an opening overlappedwith a display region of the electro-optic panel and blocks light, on asurface of the first substrate on an opposite side to the electro-opticlayer; arranging a second hook, which includes an opening overlappedwith the display region and blocks light, on a surface of the secondsubstrate on an opposite side to the electro-optic layer; arranging alower mold die so as to be in contact with a part of the first hook;arranging an upper mold die so as to be in contact with a part of thesecond hook; and forming a mold in an outer circumference of theelectro-optic panel by supplying softened resin to the lower mold die.

Since the mold is formed in the outer circumference of the electro-opticpanel via the first hook and the second hook by using the upper mold dieand the lower mold die in this application example, it is possible toextend the length of the interface between the substrates and the moldfrom the sealing material which is pinched between the pair ofsubstrates, namely the first substrate and the second substrate to thesurface of the first hook on the opposite side to the sealing materialand the surface of the second hook on the opposite side to the sealingmaterial. Therefore, it is possible to suppress entry of moisture intothe electro-optic layer via the interface and the sealing material.

In addition, since the first hook and the second hook made of a metalmaterial are arranged so as to be in contact with the electro-opticpanel, it is possible to release the heat accumulated in theelectro-optic panel via the first hook and the second hook. Moreover,since the hooks with a parting function are arranged near theelectro-optic panel, it is possible to improve parting accuracy.

Application Example 17

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include coatingthe surface of the mold with a material with liquid repellency afterforming the mold.

Since the coating processing is performed on the mold in thisapplication example, it is possible to suppress transmission of moisturethrough the mold and entry of the moisture into the electro-optic layer.

Application Example 18

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include formingTeflon (registered trademark) on surfaces of the upper mold die and thelower mold die.

Since Teflon is formed on the mold dies in this application example, itis possible to facilitate separation of the mold, which is supplied tothe mold dies, from the mold dies.

Application Example 19

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga third substrate between a surface of the first substrate on anopposite side to the electro-optic layer and the first hook and betweena surface of the second substrate on an opposite side to theelectro-optic layer and the second hook.

Since the third substrate (dust proofing glass, for example) is arrangedin the electro-optic panel in this application example, it is possibleto prevent dust from adhering to the surface of the first substrate andthe surface of the second substrate. Therefore, even if dust adheres tothe third substrate, the dust is distantly away from the electro-opticlayer. Accordingly, in a case of using the electro-optic device in aprojection-type display apparatus, for example, the dust is in adefocused state, and it is possible to suppress appearance of the dustas an image on a projected image.

Application Example 20

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include fixing athird hook, which includes an opening overlapped with the display regionand blocks light, to the mold.

Since the light-blocking third hook which has the opening holeoverlapped with the display region is fixed to the mold in thisapplication example, it is possible to limit the range of the light,which is incident on the display region, along with the first hook andthe second hook.

Application Example 21

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include fixing aframe body so as to be in contact with the first hook or the secondhook.

Since the frame body is fixed so as to be in contact with the first hookor the second hook in this application example, it is possible torelease the heat of the substrates (electro-optic panel) via the firsthook, the second hook, and the frame body.

Application Example 22

According to this application example, there is provided an electronicapparatus including the electro-optic device as described in the aboveapplication examples.

Since the electronic apparatus includes the electro-optic device asdescribed in the above application examples according to thisapplication example, it is possible to supply an electronic apparatuscapable of improving display quality and suppressing deterioration inthe electro-optic layer.

Application Example 23

According to this application example, there is provided anelectro-optic device including: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; a mold which covers an outer circumference of theelectro-optic panel and functions as a frame; a first protection memberwhich is arranged between the first substrate and the mold and includesan opening overlapped with a display region; and a second protectionmember which is arranged between the second substrate and the mold andincludes an opening overlapped with the display region, in which themold covers a region, which is overlapped with at least a part of thesealing material in a plan view, from an end of the first substrate andan end of the second substrate on a surface of the first protectionmember and a surface of the second protection member.

Since the mold covers the region from the ends of the pair ofsubstrates, namely the first substrate and the second substrate to thesurface of the first substrate on the opposite side to the sealingmaterial and the surface of the second substrate on the opposite side tothe sealing material in this application example, it is possible toextend the length of the interface between the substrates and the mold.Therefore, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material.

Application Example 24

In the electro-optic device according to the above application example,it is preferable that the first protection member be a first supportseal and the second protection member be a second support seal.

Since the first protection member and the second protection member arearranged at portions at which the first protection member and the secondprotection member are in contact with the mold in this applicationexample, it is possible to prevent contact scratch from being generatedin the electro-optic panel.

Application Example 25

In the electro-optic device according to the above application example,it is preferable that a coating agent with liquid repellency be arrangedon the surface of the mold.

Since the coating agent is arranged on the surface of the mold in thisapplication example, it is possible to suppress transmission of moisturethrough the mold and entry of the moisture into the electro-optic layer.

Application Example 26

In the electro-optic device according to the above application example,it is preferable that a light-blocking hook which includes an openingoverlapped with a display region surrounded by the mold is arranged soas to be in contact with the surface of the mold.

Since the light-blocking hook is arranged so as to surround the displayregion in the application example, it is possible to limit the range ofthe light which is incident on the display region.

Application Example 27

In the electro-optic device according to the above embodiment, it ispreferable that a third substrate be arranged between the firstsubstrate and the first support seal and between the second substrateand the second support seal.

Since the third substrate (dust proofing glass, for example) is arrangedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the third substrate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 28

According to this application example, there is provided a method ofmanufacturing an electro-optic device, the electro-optic deviceincluding an electro-optic panel including a first substrate, a secondsubstrate arranged so as to face the first substrate with a sealingmaterial interposed therebetween, and an electro-optic layer arrangedbetween the first substrate and the second substrate, the methodincluding: arranging a first protection member, which includes anopening overlapped with a display region, on a surface of the firstsubstrate on an opposite side to the electro-optic layer; arranging asecond protection member, which includes an opening overlapped with thedisplay region, on a surface of the second substrate on an opposite sideto the electro-optic layer; arranging a lower mold die in acircumference of the electro-optic panel so as to be in contact with apart of the first protection member; arranging an upper mold die on theelectro-optic panel so as to be in contact with a part of the secondprotection member; and forming a mold in an outer circumference of theelectro-optic panel by supplying softened resin to the lower mold die.

Since the mold is formed in the outer circumference of the electro-opticpanel via the first protection member and the second protection memberby using the upper mold die and the lower mold die in this applicationexample, it is possible to extend the length of the interface betweenthe substrates and the mold from the sealing material which is pinchedbetween the pair of substrates, namely the first substrate and thesecond substrate to the surface of the first protection member on theopposite side to the sealing material and the surface of the secondprotection member on the opposite side to the sealing material.Therefore, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material.

In addition, since the first protection member and the second protectionmember are arranged at such a portion so as to be in contact with thelower mold die and at such a portion so as to be in contact with theupper mold die when the mold is formed, it is possible to prevent themold dies from being brought into direct contact with the electro-opticpanel and to thereby prevent contact scratch from being generated in theelectro-optic panel.

Application Example 29

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable that the first protectionmember be a first support seal and the second protection member be asecond support seal.

Since the first support seal and the second support seal are arranged atsuch a portion so as to be in contact with the lower mold die and atsuch a portion so as to be in contact with the upper mold die when themold is formed in this application example, it is possible to preventthe mold dies from being brought into direct contact with theelectro-optic panel and to thereby prevent contact scratch from beinggenerated in the electro-optic panel.

Application Example 30

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable that in arranging the firstprotection member, a third protection member be formed in a region of anopening surrounded by the first protection member and in arranging thesecond protection member, a fourth protection member be formed in aregion of an opening surrounded by the second protection member.

According to the application example, it is possible to prevent dustfrom adhering to the display region on the substrate when the mold isformed. In addition, it is possible to obtain a display surface with nodust adhered thereto by removing the third protection member and thefourth protection member after the mold is formed.

Application Example 31

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further includeperforming coating processing on the surface of the mold to provideliquid repellency thereto after forming the mold.

Since the coating processing is performed on the mold in thisapplication example, it is possible to suppress transmittance ofmoisture through the mold and entry of the moisture into theelectro-optic layer.

Application Example 32

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include formingTeflon (registered trademark) on surfaces of the upper mold die and thelower mold die before forming the mold.

Since Teflon is formed on the mold dies in this application example, itis possible to facilitate separation of the mold, which is supplied tothe mold dies, from the mold dies.

Application Example 33

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga third substrate between a surface of the first substrate on anopposite side to the electro-optic layer and the first protection memberand between a surface of the second substrate on an opposite side to theelectro-optic layer and the second protection member.

Since the third substrate (dust proofing glass, for example) is arrangedin the electro-optic panel in this application example, it is possibleto prevent dust from adhering to the surface of the first substrate andthe surface of the second substrate. Therefore, even if dust adheres tothe third substrate, the dust is distantly away from the electro-opticlayer. Accordingly, in a case of using the electro-optic device in aprojection-type display apparatus, for example, the dust is in adefocused state, and it is possible to suppress appearance of the dustas an image on a projected image.

Application Example 34

According to this application example, there is provided an electronicapparatus including the electro-optic device as described in the aboveapplication examples.

Since the electronic apparatus includes the electro-optic device asdescribed in the above application examples according to thisapplication example, it is possible to supply an electronic apparatuscapable of improving display quality and suppressing deterioration inthe electro-optic layer.

Application Example 35

According to this application example, there is provided anelectro-optic device including: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; a frame which is arranged in a circumference of theelectro-optic panel; and a mold which is arranged between theelectro-optic panel and the frame, in which the mold covers a region,which is overlapped with at least a part of the sealing material in aplan view, from an end of the first substrate and an end of the secondsubstrate on a surface of the first substrate on an opposite side to theelectro-optic layer and a surface of the second substrate on an oppositeside to the electro-optic layer.

Since the mold covers the region, which is surrounded by the frame, fromthe surface of the first substrate on the opposite side to theelectro-optic layer to the surface of the second substrate on theopposite side to the electro-optic layer in the circumference of theelectro-optic panel in this application example, it is possible toextend the length of the interface between the substrates and the mold.Therefore, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material.

Application Example 36

In the electro-optic device according to the above application example,it is preferable that an end of the frame be arranged so as to be incontact with the surface of the first substrate on the opposite side tothe electro-optic layer, the other end of the frame be arranged at ahigher position than the surface of the second substrate on the oppositeside to the electro-optic layer, and the height of the upper surface ofthe mold be located between the other end of the frame and the surfaceof the second substrate on the opposite side to the electro-optic layer.

Since the upper surface of the mold is located between a height positionof the other end of the frame and a height position of the surface ofthe second substrate on the opposite side to the electro-optic layer inthis application example, it is possible to cover at least a part of thesurface of the second substrate on the opposite side to theelectro-optic layer with the mold. Therefore, it is possible to extendthe length of the interface between the substrates and the mold andthereby to suppress entry of moisture into the electro-optic layer viathe interface and the sealing material.

Application Example 37

In the electro-optic device according to the above application example,it is preferable that a support seal be arranged on the surface of thesecond substrate on the opposite side to the electro-optic layer and theheight position of the upper surface of the mold be located between alower surface and an upper surface of the support seal.

Since the height position of the upper surface of the mold is locatedwithin a range of a thickness of the support seal in this applicationexample, it is possible to cover a region up to a position, in which thesupport seal is arranged, in the second substrate with the mold.Therefore, it is possible to extend the length of the interface betweenthe substrates and the mold.

Application Example 38

In the electro-optic device according to the above application example,it is preferable that a light-blocking hook which includes an openinghole in a region overlapped with the display region be arranged so as tobe in contact with the frame.

Since the light-blocking hook which includes the opening hole in theregion overlapped with the display region is arranged, in other words,since the light-blocking hook is arranged so as to surround the displayregion in this application example, it is possible to limit the range ofthe light which is incident on the display region.

Application Example 39

In the electro-optic device according to the above application example,it is preferable that a first light-transmitting plate be arrangedbetween the first substrate and the mold and a second light-transmittingplate be arranged between the second substrate and the mold.

Since the first light-transmitting plate and the secondlight-transmitting plate (dust proofing glass, for example) are arrangedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the first light-transmitting plate and the secondlight-transmitting plate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus, for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 40

According to this application example, there is provided a method ofmanufacturing an electro-optic device, the electro-optic deviceincluding an electro-optic panel including a first substrate, a secondsubstrate arranged so as to face the first substrate with a sealingmaterial interposed therebetween, and an electro-optic layer arrangedbetween the first substrate and the second substrate, the methodincluding: arranging a frame in a circumference of the electro-opticpanel; and arranging a mold in the circumference of the electro-opticpanel by supplying the mold between the frame and the electro-opticpanel.

Since the mold is supplied between the frame and the electro-optic panelin this application example, it is possible to cover the circumferenceof the electro-optic panel with the mold. Therefore, it is possible toextend the length of the interface between the substrates and the moldand to thereby suppress entry of moisture into the electro-optic layervia the interface and the sealing material.

Application Example 41

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable that an end of the frame bearranged so as to be in contact with the surface of the first substrateon the opposite side to the electro-optic layer, the other end of theframe is arranged at a higher position than the surface of the secondsubstrate on the opposite side to the electro-optic layer, and inarranging the mold, the height position of the upper surface of the moldbe located between the other end of the frame and the surface of thesecond substrate on the opposite side to the electro-optic layer.

Since the mold is supplied such that the height position of the uppersurface of the mold is located between the other end of the frame andthe surface of the second substrate on the opposite side to theelectro-optic layer in this application example, it is possible to coverthe region in the circumference of the electro-optic panel from at leasta part of the surface of the first substrate on the opposite side to theelectro-optic layer to a part of the surface of the second substrate onthe opposite side to the electro-optic layer with the mold. Therefore,it is possible to extend the length of the interface between thesubstrates and the mold and to thereby suppress entry of moisture intothe electro-optic layer via the interface and the sealing material.

Application Example 42

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga support seal on the surface of the second substrate on the oppositeside to the electro-optic layer before arranging the mold, and it ispreferable that in arranging the mold, the mold be supplied such thatthe upper surface of the mold is located between the lower surface andthe upper surface of the support seal.

Since the mold is supplied such that the height position of the uppersurface of the mold is located between the lower surface and the uppersurface of the support seal in this application example, it is possibleto cover the region in the circumference of the electro-optic panel upto at least the portion, in which the support seal is arranged, in thesecond substrate with the mold.

Application Example 43

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga light-blocking hook, which includes an opening hole in a regionoverlapped with the display region, so as to be in contact with theframe after arranging the mold.

Since the light-blocking hook which includes the opening hole in theregion overlapped with the display region is arranged, in other words,the light-blocking hook is arranged so as to surround the displayregion, it is possible to limit the range of the light which is incidenton the display region.

Application Example 44

In the method of manufacturing an electro-optic device according to theapplication example, it is preferable to further include arranging afirst light-transmitting plate on the first substrate on the oppositeside to the electro-optic layer and arranging a secondlight-transmitting plate on the second substrate on the opposite side tothe electro-optic layer before arranging the frame.

Since the first light-transmitting plate and the secondlight-transmitting plate (dust proofing glass, for example) are arrangedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the third substrate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus, for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 45

According to this application example, there is provided an electronicapparatus including the electro-optic device as described in the aboveapplication examples.

Since the electronic apparatus includes the electro-optic device asdescribed in the above application examples according to thisapplication example, it is possible to supply an electronic apparatuscapable of improving display quality and suppressing deterioration inthe electro-optic layer.

Application Example 46

According to this application example, there is provided anelectro-optic device including: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; and a mold which is arranged so as to cover a circumference ofthe electro-optic panel, in which the mold covers a region, which isoverlapped with at least a part of the sealing material in a plan view,from an end of the first substrate and an end of the second substrate ona surface of the first substrate on an opposite side to theelectro-optic layer and on a surface of the second substrate on anopposite side to the electro-optic layer, and in which a first resin isarranged so as to cover the mold.

Since the first resin is arranged on the surface of the mold in thisapplication example, it is possible to suppress entry of moisture intothe mold. As a result, it is possible to suppress entry of the moistureinto the electro-optic layer via the mold and the sealing material.

Application Example 47

In the electro-optic device according to the above application example,it is preferable to further include a frame arranged in thecircumference of the electro-optic panel, and it is preferable that themold be arranged between the electro-optic panel and the frame and thefirst resin be arranged so as to cover the mold in a region where theframe is opened.

Since the mold covers the region in the circumference of theelectro-optic panel from the surface of the first substrate on theopposite side to the electro-optic layer to the surface of the secondsubstrate on the opposite side to the electro-optic layer, which issurrounded by the frame, in this application example, it is possible toextend the length of the interface between the substrates and the mold.Therefore, it is possible to suppress entry of moisture into theelectro-optic layer via the interface and the sealing material. Inaddition, since the first resin is arranged on the surface of the moldin the region where the frame is opened, namely on the surface of theexposed mold, it is possible to suppress entry of moisture into themold. As a result, it is possible to suppress entry of the moisture intothe electro-optic layer via the mold and the sealing material.

Application Example 48

In the electro-optic device according to the above application example,it is preferable that second resin be arranged so as to cover a portionwhere the electro-optic panel is brought into contact with the frame.

Since the second resin is arranged so as to cover the portion where theelectro-optic panel is brought into contact with the frame, specificallya portion where a back side of the electro-optic panel is brought intocontact with the frame in this application example, it is possible tosuppress entry of moisture from a joint portion between theelectro-optic panel and the frame.

Application Example 49

In the electro-optic device according to the above application example,it is preferable that an end of the frame be arranged so as to be incontact with the surface of the first substrate on the opposite side tothe electro-optic layer, the other end of the frame be arranged at ahigher position than the surface of the second substrate on the oppositeside to the electro-optic layer, and the upper surface of the mold belocated between the other end of the frame and the surface of the secondsubstrate on the opposite side to the electro-optic layer.

Since the upper surface of the mold is located between the heightposition of the other end of the frame and the height position of thesurface of the second substrate on the opposite side to theelectro-optic layer in this application example, it is possible to coverat least a part of the surface of the second substrate on the oppositeside to the electro-optic layer with the mold. Therefore, it is possibleto extend the length of the interface between the substrates and themold and to thereby suppress entry of moisture into the electro-opticlayer via the interface and the sealing material.

Application Example 50

In the electro-optic device according to the above application example,it is preferable that a support seal be arranged on the surface of thesecond substrate on the opposite side to the electro-optic layer and theupper surface of the mold be located between the lower surface and theupper surface of the support seal.

Since the height position of the upper surface is located within a rangeof a thickness of the support seal in this application example, it ispossible to cover a region up to a position, in which the support sealis arranged, in the second substrate with the mold. Therefore, it ispossible to extend the length of the interface between the substratesand the mold.

Application Example 51

In the electro-optic device according to the above application example,it is preferable that a hook which includes an opening hole in a regionoverlapped with the display region be arranged so as to be in contactwith the frame and the hook block light.

Since the light-blocking hook which includes the opening hole in theregion overlapped with the display region is arranged, in other words,the light-blocking hook is arranged so as to surround the display regionin this application example, it is possible to limit the range of thelight which is incident on the display region.

Application Example 52

In the electro-optic device according to the above application example,it is preferable that a first light-transmitting plate be arrangedbetween the first substrate and the mold and a second light-transmittingplate be arranged between the second substrate and the mold.

Since the first light-transmitting plate and the secondlight-transmitting plate (dust proofing glass, for example) are arrangedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the first light-transmitting plate and the secondlight-transmitting plate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus, for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 53

According to this application example, there is provided a method ofmanufacturing an electro-optic device, the electro-optic deviceincluding an electro-optic panel including a first substrate, a secondsubstrate arranged so as to face the first substrate with a sealingmaterial interposed therebetween, and an electro-optic layer arrangedbetween the first substrate and the second substrate, the methodincluding: arranging a frame in a circumference of the electro-opticpanel; arranging a mold in the circumference of the electro-optic panelby supplying mold between the frame and the electro-optic panel; andarranging a first resin so as to cover the mold in a region where theframe is opened.

Since the mold is supplied between the frame and the electro-optic panelin this application example, it is possible to cover the circumferenceof the electro-optic panel with the mold. Specifically, it is possibleto cover the region from the surface of the first substrate on theopposite side to the electro-optic layer to the surface of the secondsubstrate on the opposite side to the electro-optic layer, for example,with the mold. Therefore, it is possible to extend the length of theinterface between the substrates and the mold and to thereby suppressentry of moisture into the electro-optic layer via the interface and thesealing material. In addition, since the first resin is arranged on thesurface of the mold in the region where the frame is opened, in otherwords, on the surface of the exposed mold, it is possible to suppressentry of moisture into the mold. As a result, it is possible to suppressentry of moisture into the electro-optic layer via the mold and thesealing material.

Application Example 54

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga second resin so as to cover a portion where the electro-optic panel isbrought into contact with the frame.

Since the second resin is arranged so as to cover the portion where theelectro-optic panel is brought into contact with the frame,specifically, a portion where the back side of the electro-optic panelis brought into contact with the frame, for example, in this applicationexample, it is possible to suppress entry of moisture from the jointportion between the electro-optic panel and the frame.

Application Example 55

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable that in arranging the frame,the frame be arranged such that an end of the frame is in contact withthe surface of the first substrate on the opposite side to theelectro-optic layer, the frame be arranged such that the other end ofthe frame is located at a higher position than the surface of the secondsubstrate on the opposite side to the electro-optic layer, and inarranging the mold, the mold be supplied such that the upper surface ofthe mold is located between the other end of the frame and the surfaceof the second substrate on the opposite side to the electro-optic layer.

Since the mold is supplied such that the height position of the uppersurface of the mold is located between the other end of the frame andthe surface of the second substrate on the opposite side to theelectro-optic layer in this application example, it is possible to coverthe region in the circumference of the electro-optic panel at least froma part of the surface of the first substrate on the opposite side to theelectro-optic layer to a part of the surface of the second substrate onthe opposite side to the electro-optic layer with the mold. Therefore,it is possible to extend the length of the interface between thesubstrates and the mold and to thereby suppress entry of moisture intothe electro-optic layer via the interface and the sealing material.

Application Example 56

In the method of manufacturing an electro-optic device, it is preferableto further include arranging a support seal on the surface of the secondsubstrate on the opposite side to the electro-optic layer beforearranging the mold, and it is preferable that in arranging the mold, themold be supplied such that the upper surface of the mold is locatedbetween the lower surface and the upper surface of the support seal.

Since the mold is supplied such that the height position of the uppersurface of the mold is located between the lower surface and the uppersurface of the support seal in this application example, it is possibleto cover the region in the circumference of the electro-optic panel atleast up to the portion, in which the support seal is arranged, of thesecond substrate with the mold.

Application Example 57

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga hook, which includes the opening hole in the region overlapped withthe display region, so as to be in contact with the frame afterarranging the mold, and it is preferable that the hook block light.

Since the light-blocking hook which includes the opening hole in theregion overlapped with the display region is arranged, in other words,the light-blocking hook is arranged so as to surround the display regionin this application example, it is possible to limit the range of thelight which is incident on the display region.

Application Example 58

In the method of manufacturing an electro-optic device according to theabove application example, it is preferable to further include arranginga first light-transmitting plate on the first substrate on the oppositeside to the electro-optic layer and arranging a secondlight-transmitting plate on the second substrate on the opposite side tothe electro-optic layer before arranging the frame.

Since the first light-transmitting plate and the secondlight-transmitting plate (dust proofing glass, for example) are arrangedin the electro-optic panel in this application example, it is possibleto prevent dust and the like from adhering to the surface of the firstsubstrate and the surface of the second substrate. Therefore, even ifdust adheres to the first light-transmitting plate and the secondlight-transmitting plate, the dust is distantly away from theelectro-optic layer. Accordingly, in a case of using the electro-opticdevice in a projection-type display apparatus, for example, the dust isin a defocused state, and it is possible to suppress appearance of thedust as an image on a projected image.

Application Example 59

According to this application example, there is provided an electronicapparatus including the electro-optic device as described in the aboveapplication examples.

Since the electronic apparatus includes the electro-optic device asdescribed in the above application examples according to thisapplication example, it is possible to supply an electronic apparatuscapable of improving display quality and suppressing deterioration inthe electro-optic layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are diagrams schematically showing a configuration of aprojection-type display apparatus as an example of an electronicapparatus according to a first embodiment.

FIG. 2 is a diagram schematically showing a configuration of an opticalunit used in the projection-type display apparatus according to thefirst embodiment.

FIG. 3 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus accordingto the first embodiment.

FIGS. 4A and 4B are diagrams schematically showing a configuration of aliquid crystal panel according to the first embodiment.

FIG. 5 is a perspective view schematically showing a configuration of aliquid crystal device as an electro-optic device according to the firstembodiment.

FIG. 6 is a schematic cross-sectional view taken along line VI-VI in theliquid crystal device shown in FIG. 5.

FIGS. 7A and 7B are cross-sectional views schematically showing a methodof manufacturing the liquid crystal device as the electro-optic deviceaccording to the first embodiment.

FIG. 8 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thefirst embodiment.

FIG. 9 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thefirst embodiment.

FIG. 10 is a diagram schematically showing a configuration of an opticalunit used in a projection-type display apparatus according to a secondembodiment.

FIG. 11 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus accordingto the second embodiment.

FIG. 12 is a perspective view schematically showing a configuration of aliquid crystal device as an electro-optic device according to the secondembodiment.

FIG. 13 is a schematic cross-sectional view taken along line XIII-XIIIin the liquid crystal device shown in FIG. 12.

FIGS. 14A and 14B are cross-sectional views schematically showing amethod of manufacturing the liquid crystal device as the electro-opticdevice according to the second embodiment.

FIG. 15 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thesecond embodiment.

FIG. 16 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thesecond embodiment.

FIG. 17 is a diagram schematically showing a configuration of an opticalunit used in a projection-type display apparatus according to a thirdembodiment.

FIG. 18 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus accordingto the third embodiment.

FIG. 19 is a perspective view schematically showing a configuration of aliquid crystal device as an electro-optic device according to the thirdembodiment.

FIG. 20 is a schematic cross-sectional view taken along line XX-XX inthe liquid crystal device shown in FIG. 19.

FIGS. 21A and 21B are cross-sectional views schematically showing amethod of manufacturing the liquid crystal device as the electro-opticdevice according to the third embodiment.

FIG. 22 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thethird embodiment.

FIG. 23 is a cross-sectional view schematically showing a configurationof a liquid crystal device according to a modification example of thethird embodiment.

FIG. 24 is a diagram schematically showing a configuration of an opticalunit used in a projection-type display apparatus according to a fourthembodiment.

FIG. 25 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus accordingto the fourth embodiment.

FIG. 26 is a perspective view schematically showing a configuration of aliquid crystal device as an electro-optic device according to the fourthembodiment.

FIG. 27 is a schematic cross-sectional view taken along line XXVII-XXVIIin the liquid crystal device shown in FIG. 26.

FIGS. 28A and 28B are cross-sectional views schematically showing amethod of manufacturing the liquid crystal device according to thefourth embodiment.

FIGS. 29A and 29B are cross-sectional views schematically showing themethod of manufacturing the liquid crystal device according to thefourth embodiment.

FIG. 30 is a diagram schematically showing a configuration of an opticalunit used in a projection-type display apparatus according to a fifthembodiment.

FIG. 31 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus accordingto the fifth embodiment.

FIG. 32 is a perspective view schematically showing a configuration of aliquid crystal device as an electro-optic device according to the fifthembodiment.

FIG. 33 is a schematic cross-sectional view taken along lineXXXIII-XXXIII in the liquid crystal device shown in FIG. 32.

FIGS. 34A and 34B are cross-sectional views schematically showing amethod of manufacturing the liquid crystal device according to the fifthembodiment.

FIGS. 35A to 35C are cross-sectional views schematically showing themethod of manufacturing the liquid crystal device according to the fifthembodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

An embodiment of the invention will be described below with reference tothe drawings. The drawings are appropriately shown in an enlarged manneror a contracted manner such that parts to be described can berecognized.

Furthermore, a description “on a substrate”, for example, includes acase where a component is arranged so as to be in contact with thesubstrate, a case where the component is arranged over the substrate viaanother constituent element, and a case where the component is arrangedsuch that a part thereof is in contact with the substrate and the otherpart thereof is arranged via another constituent element in embodimentsdescribed below.

The following embodiments will be described by exemplifying an activematrix-type liquid crystal device provided with a thin film transistor(TFT), as an example of the electro-optic device, as a pixel switchingelement. For example, the liquid crystal device can be preferably usedas light modulation means (liquid crystal light valve) in aprojection-type display apparatus (liquid crystal projector) as anexample of the electronic apparatus.

First Embodiment

Hereinafter, a first embodiment in which an example of the invention isimplemented will be described with reference to drawings.

Configuration of Electronic Apparatus

FIGS. 1A and 1B are diagrams schematically showing a configuration of aprojection-type display apparatus as an example of the electronicapparatus. FIG. 1A is a planar view schematically showing theprojection-type display apparatus when viewed from an upper side. FIG.1B is a side view schematically showing the projection-type displayapparatus when viewed from a side. FIG. 2 is a diagram schematicallyshowing a configuration of an optical unit used in the projection-typedisplay apparatus. Hereinafter, the configuration of the projection-typedisplay apparatus will be described with reference to FIGS. 1A, 1B, and2.

In a projection-type display apparatus 1, a power unit 7 is arranged ona back end side inside an exterior case 2, and a light source lamp unit8 (light source unit) and an optical unit 9 are arranged at adjacentpositions in the power unit 7 on a front side of the projection-typedisplay apparatus 1 as shown in FIGS. 1A and 1B.

Inside the exterior case 2, a base end side of a projection lens unit 6is located at the center of the optical unit 9 on the front side (lightemitting side). On a side of one side surface of the optical unit 9, aninterface substrate 11 with an input and output interface circuitmounted thereon is arranged while being directed in a forward-backwarddirection of the projection-type display apparatus 1, and a videosubstrate 12 with a video signal processing circuit mounted thereon isarranged in parallel with the interface substrate 11.

As shown in FIG. 1B, a control substrate 13 for controlling drive of theapparatus is arranged on an upper side of the light source lamp unit 8and the optical unit 9, and speakers 14R and 14L are arranged at therespective right and left corners on the side of the front end of theapparatus.

On the upper side and the lower side of the optical unit 9, air intakefans 15A and 15B for cooling the inside of the apparatus are arranged.In addition, an exhaust fan 16 is arranged on a side surface of theapparatus, which corresponds to the back surface side of the lightsource lamp unit 8.

Furthermore, an auxiliary cooling fan 17 for suctioning cooling air flowfrom the air intake fan 15A into the power unit 7 is arranged at aposition which faces ends of the interface substrate 11 and the videosubstrate 12. Among the fans, the air intake fan 15B functions as acooling fan for a liquid crystal panel 40 as an electro-optic panelwhich will be described later.

In FIG. 2, the respective optical elements which configure the opticalunit 9 and include a prism unit 20 configuring color light synthesizingmeans are supported by an upper light guide 21 or a lower light guide 22made of metal such as magnesium (Mg) or aluminum (Al). The upper lightguide 21 and the lower light guide 22 are fixed to an upper case 3 and alower case 4 (see FIGS. 1A and 1B) with fixation screws.

Detailed Configuration of Optical Unit

FIG. 3 is a diagram schematically showing a detailed configuration ofthe optical unit used in the projection-type display apparatus.Hereinafter, the configuration of the optical unit will be describedwith reference to FIG. 3.

As shown in FIG. 3, the optical unit 9 includes an illumination opticalsystem 923 which includes integrator lenses 921 and 922 as uniformillumination optical elements irradiated with light emitted from a lightsource lamp 805 and a color light separation optical system 924 whichseparates a light flux W emitted from the illumination optical system923 into red, green, and blue light fluxes R, G, and B.

In addition, the optical unit 9 includes three transmission-type liquidcrystal panels 40(R), 40(G), and 40(B) as liquid crystal panels (lightvalves) for modulating the light fluxes of the respective colors, aprism unit 20 as a color light synthesizing optical system forsynthesizing the modulated color light fluxes, and a projection lensunit 6 for projecting the synthesized light flux on a projection surfacein an enlarged manner. Moreover, the optical unit 9 includes a relayoptical system 927 which guides a blue light flux B from among therespective color light fluxes separated by the color light separationoptical system 924 to the corresponding liquid crystal panel 40(B).

The illumination optical system 923 is further provided with areflection mirror 931 and orthogonally bends a light axis 1 a of lightemitted from the light source lamp 805 in a direction toward the frontside of the apparatus. The integrator lenses 921 and 922 are arrangedbefore and after an optical path via the reflection mirror 931 so as toorthogonally intersect each other.

The color light separation optical system 924 is configured of ablue-green reflection dichroic mirror 941, a green reflection dichroicmirror 942, and a reflection mirror 943.

First, a blue light flux B and a green light flux G included in thelight flux W after passing through the illumination optical system 923are orthogonally reflected by the blue-green reflection dichroic mirror941 and are directed to a side of the green reflection dichroic mirror942.

A red light flux (light flux) R passes through the blue-green reflectiondichroic mirror 941, is orthogonally reflected by the reflection mirror943, and is emitted from an emitting portion 944 of the red light flux Rto a side of the prism unit 20 as the color light synthesizing opticalsystem.

Then, only a green light flux G from among the blue light flux (lightflux) B and the green light flux (light flux) G reflected by theblue-green reflection dichroic mirror 941 is orthogonally reflected bythe green reflection dichroic mirror 942 and is emitted from an emittingportion 945 of the green light flux G to the side of the color lightsynthesizing optical system.

The blue light flux B after passing through the green reflectiondichroic mirror 942 is emitted from an emitting portion 946 of the bluelight flux B to a side of the relay optical system 927.

According to this embodiment, all the distances from the light fluxemitting portions of the illumination optical system 923 to the emittingportions 944, 945, and 946 for the light fluxes of the respective colorsR, G, and B in the color light separation optical system 924 are set tobe substantially equal to each other.

On the emitting sides of the emitting portions 944 and 945 of the redlight flux R and the green light flux G in the color light separationoptical system 924, condensing lenses 951 and 952 are arranged,respectively. Therefore, the red light flux R and the green light flux Gemitted from the emitting portions 944 and 945 are incident on thecondensing lenses 951 and 952 and are collimated.

Polarization directions of the collimated red and green light fluxes Rand G are adjusted by polarization plates 160(R) and 160(G), the red andgreen light fluxes R and G are then incident on and modulated at theliquid crystal panels 40(R) and 40(G), and image informationcorresponding to the light of respective colors is added thereto. Thatis, the liquid crystal panels 40(R) and 40(G) are switching-controlledbased on an image signal corresponding to the image information by drivemeans, which is not shown in the drawing, and the light of therespective colors passing therethrough is thus modulated. As the drivemeans, it is possible to use known means without any change.

In contrast, the blue light flux B is made to pass through the relayoptical system 927, a polarization direction thereof is further adjustedby a polarization plate 160(B), the blue light flux B is then guided tothe corresponding liquid crystal panel 40(B) and is incident on andmodulated at the liquid crystal panel 40(B) in the same manner as theaforementioned liquid crystal panels 40(R) and 40(G), and imageinformation corresponding to the blue light is added thereto.

The relay optical system 927 is configured of a condensing lens 974, anincident-side reflection mirror 971, an outgoing-side reflection mirror972, an intermediate lens 973 arranged between these mirrors, and acondensing lens 953 arranged in front of the liquid crystal panel 40(B).

As for lengths of optical paths of the respective color light fluxes R,G, and B, namely distances from the light source lamp 805 to therespective liquid crystal panels 40(R), 40(G), and 40(B), the length ofthe optical path of the blue light flux B is the longest, and opticalloss of the light flux is the highest. However, it is possible tosuppress the optical loss by providing the relay optical system 927 inthe optical path of the blue light flux B.

The respective color light fluxes after passing through and beingmodulated at the liquid crystal panels 40(R), 40(G), and 40(B) areincident on the polarization plates 161(R), 161(G), and 161(B), andlight transmitted therethrough is incident on and synthesized by theprism unit 20 (cross dichroic prism). A color image synthesized thereinis projected in an enlarged manner to a projection surface 1 b, such asa screen, at a predetermined position via the projection lens unit 6provided with a projection lens system.

Configuration of Electro-Optic Panel

FIGS. 4A and 4B are diagrams schematically showing a configuration of aliquid crystal panel as the electro-optic panel. FIG. 4A is a planarview schematically showing the configuration of the liquid crystalpanel, and FIG. 4B is a schematic cross-sectional view taken along lineVI-VI in the liquid crystal panel shown in FIG. 4A. Hereinafter, theconfiguration of the liquid crystal panel will be described withreference to FIGS. 4A and 4B.

In FIGS. 4A, 4B, and 5, a traveling direction of light from the lightsource is represented by the arrow L11, a traveling direction of displaylight obtained after modulating the light from the light source by theliquid crystal panel 40 is represented by the arrow L12, and a flow ofcooling air (cooling gas) supplied to the liquid crystal panel 40 by theair intake fan 15B and the like shown in FIGS. 1A and 1B will be omittedin the drawing.

In the following description, one of directions which intersect eachother in an in-plane direction of the liquid crystal panel 40 and aliquid crystal device 1000 is referred to as an X-axis direction, theother direction is referred to as a Y-axis direction, and a directionwhich intersects with the X-axis direction and the Y-axis direction isreferred to as a Z-axis direction.

In the drawings to be referred to in the following description, one sidein the Y-axis direction (a side on which a flexible wiring substrate 90is provided) is referred to as a Y1 side, the other side thereof isreferred to as a Y2 side, one side in the X-axis direction is referredto as an X1 side, the other side thereof is referred to as an X2 side,one side in the Z-axis direction (a side on which the light from thelight source is incident) will be referred to as a Z1 side, and theother side (a side on which the display light is emitted) is referred toas a Z2 side.

In the projection-type display apparatus 1 described above withreference to FIGS. 1A, 1B, 2, and 3, the liquid crystal panels 40(R),40(G), and 40(B) are mounted in a state of being provided at the liquidcrystal devices 1000(R), 1000(G), and 1000(B) when the liquid crystalpanels 40(R), 40(G), and 40(B) are mounted on the optical unit 9.

The liquid crystal panels 40(R), 40(G), and 40(B) have the sameconfiguration, and the liquid crystal devices 1000(R), 1000(G), and1000(B) provided with the liquid crystal panels 40(R), 40(G), and 40(B)also have the same configuration for the red color (R), the green color(G), and the blue color (B). Therefore, the liquid crystal panels 40(R),40(G), and 40(B) and the liquid crystal devices 1000(R), 1000(G), and1000(B) will be described without adding (R), (G), and (B) representingthe corresponding colors in the following description.

As shown in FIGS. 4A and 4B, a light-transmitting element substrate 51(first substrate) and a light-transmitting facing substrate 52 (secondsubstrate) are attached with a sealing material 407 with a predeterminedgap interposed therebetween in the liquid crystal panel 40. For theelement substrate 51 and the facing substrate 52, it is possible to usequartz glass, heat-resistant glass, or the like. In this embodiment,quartz glass is used for the element substrate 51 and the facingsubstrate 52.

In this embodiment, a liquid crystal layer 450 as the electro-opticlayer is held in a region surrounded by the sealing material 407 betweenthe element substrate 51 and the facing substrate 52 in the liquidcrystal panel 40.

The sealing material 407 is provided in a frame shape so as to extendalong an outer edge of the facing substrate 52. The sealing material 407is a photo-curable adhesive agent, a thermoset adhesive agent, or aphoto-curable thermoset adhesive agent, and a gap material such as glassfiber or glass beads is blended therein in order to set the distancebetween the substrates to a predetermined value.

Here, a part of the sealing material 407 is disconnected, and such adisconnected portion forms a liquid crystal inlet port 407 a. Inaddition, the liquid crystal inlet port 407 a is sealed with a sealingmaterial 406 after injection of a liquid crystal material to form theliquid crystal layer 450.

In this embodiment, the element substrate 51 has a square shape in aplan view and has side surfaces 511, 512, 513, and 514 configured offour sides. The facing substrate 52 also has a square shape in a planview and has side surfaces 521, 522, 523, and 524 configured of foursides in the same manner as the element substrate 51.

An image display region 40 a which emits modulated light is provided asa square region substantially at the center of the liquid crystal panel40. In accordance with such a shape, the sealing material 407 isprovided to have a substantially square shape, and a square frame-shapedcircumferential region 40 c is provided between an inner circumferentialedge of the sealing material 407 and an outer circumferential edge ofthe image display region 40 a.

In this embodiment, the element substrate 51 has a larger size than thefacing substrate 52, and the four side surfaces 511, 512, 513, and 514of the element substrate 51 respectively extend further outside than theside surfaces 521, 522, 523, and 524 of the facing substrate 52.Therefore, stepped portions are formed in the circumference of thefacing substrate 52 by the element substrate 51 and the side surfaces521, 522, 523, and 524 of the facing substrate 52, and the elementsubstrate 51 is exposed from the facing substrate 52 at such steppedportions.

Light-transmitting pixel electrodes 405 a and pixels provided with pixeltransistors (switching elements; not shown in the drawing) correspondingto the pixel electrodes 405 a are formed in a matrix shape in the imagedisplay region 40 a on a first surface 51 a, which faces the facingsubstrate 52, from among the first surface 51 a (one side surface) and asecond surface 51 b (the other side surface) of the element substrate51, and an oriented film 416 is formed on an upper layer side of thepixel electrodes 405 a.

In addition, dummy pixel electrodes 405 b which are formed at the sametime as the pixel electrodes 405 a are formed in the circumferentialregion 40 c on the first surface 51 a of the element substrate 51. Forthe dummy pixel electrodes 405 b, a configuration of being electricallyconnected to dummy pixel transistors, a configuration of being directlyand electrically connected to wiring without providing the dummy pixeltransistors, or a configuration of being brought into a floating statein which no potential is applied thereto is employed.

The side surface 514 of the element substrate 51, which is located onthe Y1 side in the Y-axis direction projects from the side surface 524of the facing substrate 52 to a greater extent than the stepped portionsbetween the other side surfaces 511, 512, and 513 and the side surfaces521, 522, and 523 of the facing substrate 52 to form a projectingportion 515, and a data line drive circuit 401 and a plurality of firstterminals 402 are formed along the side surface 514 at an end portion ofa surface (first surface 51 a) of the projecting portion 515 on a sideof the facing substrate 52. In addition, a scanning line drive circuit404 is formed along the side surfaces 511 and 512 on the elementsubstrate 51.

In addition, the flexible wiring substrate 90 is connected to theelement substrate 51. A second terminal 902 is formed at a position, atwhich the second terminal 902 is overlapped with the first terminal 402in a plan view, on a first surface 90 a which faces the elementsubstrate 51 from among the first surface 90 a and a second surface 90 bof the flexible wiring substrate 90, and the first terminal 402 and thesecond terminal 902 are electrically connected to each other. Therefore,various potentials and various signals are input to the elementsubstrate 51 via the flexible wiring substrate 90. Although variousmethods can be applied for the connection between the first terminal 402and the second terminal 902, the connection between the first terminal402 and the second terminal 902 is established by an anisotropicconductive material in this embodiment.

A light-transmitting common electrode 421 is formed on a first surface52 a which faces the element substrate 51 from among the first surface52 a and a second surface 52 b of the facing substrate 52, and anoriented film 426 is formed as an upper layer of the common electrode421. The common electrode 421 is formed on substantially the entiresurface of the facing substrate 52 or is formed so as to be laid acrossa plurality of pixels as a plurality of band-shaped electrodes, and inthis embodiment, the common electrode 421 is formed on substantially theentire surface of the facing substrate 52.

In addition, a light-blocking layer 408 is formed on a lower layer sideof the common electrode 421 on the first surface 52 a of the facingsubstrate 52. In this embodiment, the light-blocking layer 408 is formedin a picture-frame shape extending along the outer circumferential edgeof the image display region 40 a, and the image display region 40 a isdefined by an inner edge of the light-blocking layer 408. In addition,the light-blocking layer 408 is formed as a black matrix or a blackstripe in a region which is overlapped with a region interposed betweenadjacent pixel electrodes 405 a on the facing substrate 52 in somecases.

In regions which are overlapped with corner portions of the facingsubstrate 52 further outside than the sealing material 407 on theelement substrate 51, an inter-substrate continuity electrode 409 forestablishing electrical continuity between the element substrate 51 andthe facing substrate 52 is formed. An inter-substrate continuitymaterial 409 a containing conductive particles is arranged between theinter-substrate continuity electrode 409 and the facing substrate 52,and the common electrode 421 of the facing substrate 52 is electricallyconnected to the side of the element substrate 51 via theinter-substrate continuity material 409 a and the inter-substratecontinuity electrode 409. Therefore, a common potential is applied tothe common electrode 421 from the side of the element substrate 51. Thesealing material 407 is provided so as to have substantially the samewidth dimension and extend along an outer circumferential edge of thefacing substrate 52.

In the liquid crystal panel 40 with such a configuration, the liquidcrystal panel 40 is a transmission-type liquid crystal panel in thisembodiment since the pixel electrodes 405 a and the common electrode 421are formed of light-transmitting conductive films such as ITO films. Inthe case of such a transmission-type liquid crystal panel 40, lightwhich is incident from a substrate on one side from among the elementsubstrate 51 and the facing substrate 52 is modulated while transmittedthrough and emitted from a substrate on the other side.

This embodiment is configured such that light (represented by the arrowL11) which is incident from the facing substrate 52 is transmittedthrough and emitted as modulated light (represented by the arrow L12)from the element substrate 51. Therefore, the facing substrate 52 isarranged on the Z1 side in the Z-axis direction, and the elementsubstrate 51 is arranged on the Z2 side in the Z-axis direction.

If the common electrode 421 is formed of a light-transmitting conductivefilm and the pixel electrodes 405 a are formed of reflective conductivefilms, then it is possible to configure a reflection-type liquid crystalpanel. In the case of the reflection-type liquid crystal panel, thelight which is incident from the side of the facing substrate 52 ismodulated while being reflected by and emitted from the side of theelement substrate 51.

Since the liquid crystal panel 40 according to this embodiment is usedas a light valve in the aforementioned projection-type display apparatus1 (liquid crystal projector), a color filter is not formed. However, acolor filter is formed on the facing substrate 52 in a case of using theliquid crystal panel 40 as a direct-view-type color display apparatusfor an electronic apparatus such as a mobile computer or a mobile phone.

Configuration of Electro-Optic Device

FIG. 5 is a perspective view schematically showing a configuration of aliquid crystal device as the electro-optic device. FIG. 6 is a schematiccross-sectional view taken along line XI-XI in the liquid crystal deviceshown in FIG. 5. Hereinafter, the configuration of the liquid crystaldevice will be described with reference to FIGS. 5 and 6. In FIG. 6,depiction and description of the flexible wiring substrate 90 areomitted.

When the liquid crystal panel 40 described above with reference to FIGS.4A and 4B is mounted on the projection-type display apparatus 1described above with reference to FIGS. 1A, 1B, 2, and 3 and the opticalunit 9, the flexible wiring substrate 90 is connected to the liquidcrystal panel 40, and the liquid crystal device 1000 in which a mold1060 is arranged so as to cover the outer circumference of the liquidcrystal panel 40 for the purpose of moisture resistance andreinforcement is then obtained as shown in FIGS. 5 and 6.

Specifically, the mold 1060 is a member which is provided with arectangular opening hole at the center thereof, has an outer shapefunctioning as a frame, and is made of resin, and accommodates theliquid crystal panel 40 therein. The mold 1060 is formed ofsilicon-based resin, for example.

As shown in FIG. 6, the mold 1060 is provided so as to cover a regionfrom the surface of the first light-transmitting plate 56 as a thirdsubstrate on the opposite side (Z1) to the liquid crystal layer 450 tothe surface of the second light-transmitting plate 57 as the thirdsubstrate on the opposite side (Z2) to the liquid crystal layer 450.Specifically, the mold 1060 is provided so as to cover up to a regionwhich is overlapped with the sealing material 407 in a plan view. Theopening hole is opened such that the mold 1060 is not arranged at leastin a region which is overlapped with the image display region 40 a.

As shown in FIGS. 4A, 4B, 5, and 6, the first light-transmitting plate56 is attached to the second surface 51 b (the outer surface; thesurface of the element substrate 51 on the opposite side to the facingsubstrate 52) of the element substrate 51 with an adhesive agent and thesecond light-transmitting plate 57 is attached to the second surface 52b (the outer surface; the surface of the facing substrate 52 on theopposite side to the element substrate 51) of the facing substrate 52 inthe liquid crystal panel 40 when the liquid crystal device 1000 isconfigured by using the liquid crystal panel 40 according to thisembodiment.

The first light-transmitting plate 56 and the second light-transmittingplate 57 are respectively configured as dust proofing glass and preventsdust and the like from adhering to the outer surface (second surface 51b) of the element substrate 51 and the outer surface (second substrate52 b) of the facing substrate 52. Therefore, if dust adheres to theliquid crystal panel 40, the dust is distantly away from the liquidcrystal layer 450. Accordingly, the dust is in a defocused state, and itis possible to suppress appearance of the dust as an image in aprojected image by the projection-type display apparatus 1 describedabove with reference to FIGS. 1A, 1B, and the like.

For the first light-transmitting plate 56 and the secondlight-transmitting plate 57, it is possible to use quartz glass,heat-resistant glass, or the like. In this embodiment, quartz glass isused for the first light-transmitting plate 56 and the secondlight-transmitting plate 57 in the same manner as the element substrate51 and the facing substrate 52, and a thickness thereof is from 1.1 mmto 1.2 mm.

The first light-transmitting plate 56 is provided so as to be overlappedwith at least the image display region 40 a in the liquid crystal panel40 in a state where a part of the second surface 51 b of the elementsubstrate 51 is exposed. More specifically, the first light-transmittingplate 56 has a square shape with a smaller size than that of the elementsubstrate 51 in a plan view, and the second surface 51 b of the elementsubstrate 51 is in the exposed state in the circumference of the firstlight-transmitting plate 56.

The second light-transmitting plate 57 is provided so as to beoverlapped with at least the image display region 40 a in the liquidcrystal panel 40 in a state where a part of the second surface 52 b ofthe facing substrate 52 is exposed. More specifically, the secondlight-transmitting plate 57 has a square shape with substantially thesame size as that of the first light-transmitting plate 56 in a planview and is smaller than the facing substrate 52. Therefore, the secondsurface 52 b of the facing substrate 52 is in the exposed state in thecircumference of the second light-transmitting plate 57.

As shown in FIG. 5, opening holes 1060 a for arranging the liquidcrystal device 1000 in the aforementioned projection-type displayapparatus 1 are provided at four corners on the upper surface of themold 1060. In addition, the invention is not limited to the openingholes 1060 a, and screw holes may be formed.

In addition, coating processing to provide liquid repellency isperformed on the surface of the mold 1060. Examples of the coatingprocessing include fluorine coating.

Since the mold 1060 is provided so as to cover the region from thesurface of the first light-transmitting plate 56 on the opposite side tothe liquid crystal layer 450 to the surface of the secondlight-transmitting plate 57 on the opposite side to the liquid crystallayer 450 as described above, it is possible to extend a length L1 ofthe interface between the mold 1060 and the substrates (the elementsubstrate 51, the facing substrate 52, the first light-transmittingplate 56, and the second light-transmitting plate 57). Accordingly, itis possible to suppress entry of moisture into the liquid crystal layer450 via the interface and the sealing material 407.

In addition, since the fluorine coating processing is performed on thesurface of the mold 1060, it is possible to suppress transmittance ofmoisture through the mold 1060 and entry of the moisture into the liquidcrystal layer 450.

Method of Manufacturing Electro-Optic Device

FIGS. 7A and 7B are cross-sectional views schematically showing a methodof manufacturing a liquid crystal device as the electro-optic device.Particularly, FIGS. 7A and 7B are cross-sectional views schematicallyshowing a method of manufacturing a mold as a frame of the liquidcrystal device. Hereinafter, the method of manufacturing the mold willbe described with reference to FIGS. 7A and 7B.

In the process shown in FIG. 7A, the liquid crystal panel 40 is arrangedin mold dies (an upper mold die 1062 and a lower mold die 1061). First,the concave-shaped lower mold die 1061 is arranged. A bottom portion1061 b of the lower mold die 1061 is provided with a convex portion 1061a for arranging the liquid crystal panel 40. Then, the liquid crystalpanel 40 is arranged on the convex portion 1061 a. Thereafter, the uppermold die 1062 is arranged on the liquid crystal panel 40.

In addition, it is desirable that Teflon is formed on the surface of theupper mold die 1062 and the surface of the lower mold die 1061.Specifically, Teflon is formed at least in portions, at which the uppermold die 1062 and the lower mold die 1061 are brought into contact withmold resin 1060 b, of the upper mold die 1062 and the lower mold die1061. With such a configuration, it is possible to facilitate separationof the mold 1060 from the upper mold die 1062 and the lower mold die1061 when the mold 1060 is formed.

In the process shown in FIG. 7B, the softened mold resin 1060 b issupplied to a space surrounded by a side wall of the lower mold die1061. First, a nozzle 1063 for supplying the mold resin 1060 b isarranged above the lower mold die 1061 (between the upper mold die 1062and the side wall of the lower mold die 1061). Then, the mold resin 1060b is supplied to the inside of the lower mold die 1061 from the nozzle1063.

The mold resin 1060 b is silicon-based resin, for example, as describedabove. Specifically, it is preferable to use silicon-based resin whichadheres to quartz and is hardened at room temperature. The amount ofmold resin 1060 b is adjusted such that at least the upper surface ofthe second light-transmitting plate 57 arranged on the facing substrate52 is buried in the mold resin 1060 b.

By forming the mold 1060 up to a level in which the upper surface of thesecond light-transmitting plate 57 is buried in the mold 1060 asdescribed above, it is possible to extend the length of the interfacebetween the second light-transmitting plate 57 and the mold 1060. Inother words, it is possible to extend the distance from a portion of thesecond light transmitting plate 57, which is in contact with ambientair, to the sealing material 407 and to thereby suppress entry ofmoisture into the liquid crystal layer 450 via the sealing material 407.

In addition, it is preferable to perform fluorine coating processing onthe surface of the mold 1060 after forming the mold 1060 in the outercircumference of the liquid crystal panel 40. With such a configuration,it is possible to suppress transmission of moisture through the mold1060 and entry of the moisture into the liquid crystal layer 450.

As described above in detail, it is possible to achieve the followingadvantages by the liquid crystal device 1000, the method ofmanufacturing the liquid crystal device 1000, and the electronicapparatus according to the first embodiment.

(1) According to the liquid crystal device 1000 and the method ofmanufacturing the liquid crystal device 1000 in the first embodiment,the mold 1060 is formed so as to cover the region from the surface ofthe first light-transmitting plate 56 on the opposite side to the liquidcrystal layer 450 to the surface of the second light-transmitting plate57 on the opposite side to the liquid crystal layer 450, and therefore,it is possible to extend the length of the interface between the mold1060 and the substrates (the element substrate 51, the facing substrate52, the first light-transmitting plate 56, and the secondlight-transmitting plate 57). For this reason, it is possible tosuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407. In addition, since the mold 1060is formed to have a large thickness, it is possible to improve moistureresistance. As a result, it is possible to suppress deterioration in theliquid crystal layer 450 and to suppress degradation in display qualitydue to a degraded controllability (responsiveness) of the liquidcrystal.

(2) According to the liquid crystal device 1000 and the method ofmanufacturing the liquid crystal device 1000 in the first embodiment,the coating processing is performed on the surface of the mold 1060, andtherefore, it is possible to suppress transmittance of moisture throughthe mold 1060 and entry of the moisture into the liquid crystal layer450.

(3) According to the liquid crystal device 1000 and the method ofmanufacturing the liquid crystal device 1000 in the first embodiment,the mold 1060 with a function as a frame is used instead of a metalframe which is used in the related art, and therefore, it is possible toemploy a frame-less configuration and to suppress the cost. In addition,it is possible to reduce the weight by employing the mold 1060.

(4) According to the electronic apparatus in the first embodiment, theabove liquid crystal device 1000 is provided therein, and therefore, itis possible to provide an electronic apparatus capable of improvingdisplay quality and suppressing deterioration in the liquid crystallayer 450.

Modification Example 1

The invention is not limited to the above configuration in which onlythe mold 1060 functioning as a frame is formed in the outercircumference of the liquid crystal device 1000, and the configurationshown in FIG. 8 may be employed. FIG. 8 is a cross-sectional viewschematically showing the configuration of a liquid crystal deviceaccording to the modification example. The liquid crystal device shownin FIG. 8 is different from the liquid crystal device 1000 according tothe above embodiment in that a hook 1071 which has a light blockingproperty and a parting function is arranged on the mold 1060.

The hook 1071 is arranged on the light incident side with respect to themold 1060 and is used as a parting unit for limiting a range of lightwhich is incident on the liquid crystal panel 40. The hook 1071 is ametal plate, for example. The hook 1071 is provided with an opening holewhich is overlapped with an opening region of the mold 1060. The openinghole of the hook 1071 is smaller than the opening hole of the mold 1060.

The hook 1071 is made of a material with higher heat conductivity thanthose of the second light-transmitting plate 57 and the liquid crystalpanel 40 (the element substrate 51 and the facing substrate 52). Morespecifically, the hook 1071 is made of metal such as aluminum or copper.Therefore, the hook 1071 also functions as a heat releasing member forreleasing heat, which is generated at the liquid crystal panel 40, viathe mold 1060. In addition, black color treatment is performed on thehook 1071 in order to suppress reflection of light.

The mold 1060 and the hook 1071 may be fixed to each other with anadhesive agent, for example, or may be fixed to each other by fitting aconvex portion of the mold 1060 into a concave portion of the hook 1071.

With such a configuration, the light-blocking hook 1071 is arranged soas to surround the image display region 40 a, and therefore, it ispossible to limit the range of the light which is incident on the imagedisplay region 40 a. In other words, it is possible to block light whichis unnecessarily incident on the region.

In addition, the invention is not limited to the arrangement of the hook1071 on the side of the facing substrate 52, and the hook 1071 may alsobe arranged on the side of the element substrate 51.

Modification Example 2

The invention is not limited to the above configuration in which onlythe mold 1060 functioning as a frame is formed in the outercircumference of the liquid crystal device 1000 or the configuration ofproviding the hook 1071 as in Modification Example 1, and theconfiguration shown in FIG. 9 may be employed. FIG. 9 is across-sectional view schematically showing a configuration of a liquidcrystal device according to Modification Example 2.

The liquid crystal device shown in FIG. 9 is different from those in theabove embodiment and Modification Example 1 in that the hook 1071 isprovided above the mold 1060 and a case 1072 as a frame body is providedbelow the mold 1060.

The hook 1071 is configured in the same manner as that in ModificationExample 1, for example. The case 1072 is a metal material such asaluminum or magnesium and is arranged so as to surround the mold 1060and be in contact with the liquid crystal panel 40.

Fixation between the mold 1060 and the hook 1071 and fixation betweenthe mold 1060 and the case 1072 may be established with an adhesiveagent or may be established by fitting these components to each other asdescribed above.

According to this modification example, the case 1072 is arranged so asto be in contact with the liquid crystal panel 40, and therefore, it ispossible to efficiently release the heat accumulated in the liquidcrystal panel 40. In addition, since the heat in the liquid crystallayer 450 is released, it is possible to suppress a decrease in lifetimeof the liquid crystal layer 450 (lifetime of the liquid crystal panel40).

Modification Example 3

The invention is not limited to the above configuration in which themold 1060 is formed in the outer circumference of the liquid crystalpanel 40 by supplying (dripping) the mold resin 1060 b to the lower molddie 1061, and the mold 1060 may be formed by a transfer mold scheme, forexample. At this time, it is preferable to employ mold resin 1060 bcapable of forming the mold 1060 at a temperature which does not affectthe liquid crystal panel 40.

Modification Example 4

As for electronic apparatuses on which the liquid crystal device 1000 ismounted as described above, it is possible to use the liquid crystaldevice 1000 for various electronic apparatuses such as an electricalview finder (EVF), a mobile mini projector, a head-up display, a smartphone, a mobile phone, a mobile computer, a digital camera, a digitalvideo camera, a display, a vehicle-mounted device, an audio device, anexposure device, and an illumination device as well as theprojection-type display apparatus 1.

Modification Example 5

The invention is not limited to the application of the liquid crystaldevice 1000 as the electro-optic device as described above, and theelectro-optic device may be applied to an organic EL device, a plasmadisplay, or an electronic paper (EPD), for example. In a case of aliquid crystal device, for example, an electro-optic material is liquidcrystal. In a case of an electronic paper, the electro-optic material isan electrophoretic material.

Second Embodiment

Hereinafter, a second embodiment in which an example of the invention isimplemented will be described with reference to drawings. In addition,the drawings to be used are appropriately shown in an enlarged manner orin a contracted manner such that parts to be described can berecognized. Furthermore, since the second embodiment is configured inthe same manner as in the first embodiment other than that theconfiguration of the liquid crystal device 1000 and the method ofmanufacturing the liquid crystal device as the electro-optic deviceaccording to the aforementioned first embodiment are different, the samereference numerals will be given to the same constituent elements asthose in the first embodiment, and the descriptions thereof will beomitted.

In this embodiment, a configuration of the electronic apparatus, adetailed configuration of the optical unit, and a configuration of theelectro-optic panel are the same as those according to theaforementioned first embodiment. However, when the liquid crystal panels40(R), 40(G), and 40(B) are mounted on the optical unit 9 shown in FIGS.10 and 11, the liquid crystal panels 40(R), 40(G), and 40(B) are mountedin a state of being provided in liquid crystal devices 2000(R), 2000(G),and 2000(B), which will be described later, respectively.

The liquid crystal panels 40(R), 40(G), and 40(B) have the sameconfiguration, and the liquid crystal devices 2000(R), 2000(G), and2000(B) for the red color (R), the green color (G), and the blue color(B) provided with the liquid panels 40(R), 40(G), and 40(B) also havethe same configuration. Therefore, the following description will begiven without adding (R), (G), and (B) which represent correspondingcolors.

Configuration of Electro-optic Device

FIG. 12 is a perspective view schematically showing a configuration ofthe liquid crystal device as the electro-optic device. FIG. 13 is aschematic cross-sectional view taken along line XIII-XIII in the liquidcrystal device shown in FIG. 12. Hereinafter, the configuration of theliquid crystal device will be described with reference to FIGS. 12 and13. In FIG. 13, depiction and description of the flexible wiringsubstrate 90 are omitted.

When the liquid crystal panel 40 described above with reference to FIGS.4A and 4B is mounted on the projection-type display apparatus 1 and theoptical unit 9 described above with reference to FIGS. 1A, 1B, 10, and11, the flexible wiring substrate 90 is connected to the liquid crystalpanel 40, and the liquid crystal device 2000 in which a mold 2060 isarranged so as to cover the outer circumference of the liquid crystalpanel 40 for the purpose of moisture resistance and reinforcement isthen obtained as shown in FIGS. 12 and 13.

Specifically, the mold 2060 is a resin member which includes arectangular opening hole at the center thereof and has an outer shapefunctioning as a frame, and accommodates the liquid crystal panel 40therein. The mold 2060 is formed of silicon-based resin, for example.

As shown in FIG. 13, the mold 2060 is provided so as to cover a regionfrom the surface of the first light-transmitting plate 56 as a thirdsubstrate on the opposite side to the liquid crystal layer 450 to thesurface of the second light-transmitting plate 57 as the third substrateon the opposite side to the liquid crystal layer 450. Specifically, themold 2060 is provided so as to cover up to the region overlapped withthe sealing material 407 in a plan view. The opening hole is opened suchthat the mold 2060 is not arranged in at least a region overlapped withthe image display region 40 a.

As shown in FIGS. 4A, 4B, 12, and 13, the first light-transmitting plate56 is attached to the second surface 51 b of the element substrate 51(outer surface; the surface of the element substrate 51 on the oppositeside to the facing substrate 52) with an adhesive agent or the like, andthe second light-transmitting plate 57 is attached to the second surface52 b of the facing substrate 52 (outer surface; the surface of thefacing substrate 52 on the opposite side to the element substrate 51)with an adhesive agent or the like in the liquid crystal panel 40 forconfiguring the liquid crystal device 2000 by using the liquid crystalpanel 40 according to this embodiment.

Since the first light-transmitting plate 56 and the secondlight-transmitting plate 57 have the same configurations as those in theaforementioned first embodiment, the descriptions thereof will beomitted.

As shown in FIG. 12, opening holes 2060 a for arranging the liquidcrystal device 2000 in the aforementioned projection-type displayapparatus 1 are provided at four corners of the upper surface of themold 2060. In addition, the invention is not limited to the openingholes 2060 a, and screw holes may be formed.

In addition, coating processing to provide liquid repellency isperformed on the surface of the mold 2060. Examples of the coatingprocessing include fluorine coating.

Since the mold 2060 is provided so as to cover the region from thesurface of the first light-transmitting plate 56 on the opposite side tothe liquid crystal layer 450 to the surface of the secondlight-transmitting plate 57 on the opposite side to the liquid crystallayer 450 as described above, it is possible to extend the length L1 ofthe interface between the mold 2060 and the substrates (the elementsubstrate 51, the facing substrate 52, the first light-transmittingplate 56, and the second light-transmitting plate 57). Therefore, it ispossible to suppress entry of moisture into the liquid crystal layer 450via the interface and the sealing material 407.

In addition, since the fluorine coating processing is performed on thesurface of the mold 2060, it is possible to suppress transmittance ofmoisture through the mold 2060 and entry of the moisture into the liquidcrystal layer 450.

In addition, a first hook 2041 a which includes an opening portion in aregion overlapped with the image display region 40 a is arranged betweenthe surface of the first light-transmitting plate 56 and the mold 2060.In contrast, a second hook 2041 b which includes an opening portion in aregion overlapped with the image display region 40 a is arranged betweenthe surface of the second light-transmitting plate 57 and the mold 2060.

The first hook 2041 a and the second hook 2041 b are made of a materialwith higher heat conductivity than those of the first light-transmittingplate 56, the second light-transmitting plate 57, and the liquid crystalpanel 40 (the element substrate 51 and the facing substrate 52). Morespecifically, the first hook 2041 a and the second hook 2041 b are madeof metal such as aluminum or copper. Therefore, the first hook 2041 aand the second hook 2041 b also function as heat releasing members forreleasing heat, which is generated at the liquid crystal panel 40,therethrough. In addition, black color treatment is performed on thesurfaces of the first hook 2041 a and the second hook 2041 b in order tosuppress reflection of light.

In addition, since the first hook 2041 a and the second hook 2041 b witha parting function are arranged near the liquid crystal panel 40, it ispossible to improve parting accuracy.

Method of Manufacturing Electro-Optic Device

FIGS. 14A and 14B are cross-sectional views schematically showing amethod of manufacturing a liquid crystal device as the electro-opticdevice. Particularly, FIGS. 14A and 14B are cross-sectional viewsschematically showing a method of manufacturing a mold as a frame of theliquid crystal device. Hereinafter, the method of manufacturing the moldwill be described with reference to FIGS. 14A and 14B.

In the process shown in FIG. 14A, the liquid crystal panel 40 isarranged in mold dies (an upper mold die 2062 and a lower mold die2061). First, the concave-shaped lower mold die 2061 is arranged. Abottom portion 2061 b of the lower mold die 2061 is provided with aconvex portion 2061 a for arranging the liquid crystal panel 40.

Next, the first light-transmitting plate 56 is arranged on the surfaceof the element substrate 51 on the opposite side to the liquid crystallayer 450 in the liquid crystal panel 40. In addition, the secondlight-transmitting plate 57 is arranged on the surface of the facingsubstrate 52 on the opposite side to the liquid crystal layer 450.

Next, the liquid crystal panel 40 is arranged on the convex portion 2061a via the first hook 2041 a. Thereafter, the upper mold die 2062 isarranged on the liquid crystal panel 40 via the second hook 2041 b.Specifically, the convex portion 2061 a and the first light-transmittingplate 56 are arranged so as to face each other, and the secondlight-transmitting plate 57 and the upper mold die 2062 are arranged soas to face each other.

It is desirable that Teflon is formed in advance on the surface of theupper mold die 2062 and the surface of the lower mold die 2061.Specifically, Teflon is formed at least in portions, at which the uppermold die 2062 and the lower mold die 2061 are brought into contact withthe mold resin 2060 b, of the upper mold die 2062 and the lower mold die2061. With such a configuration, it is possible to facilitate separationof the mold 2060 from the upper mold die 2062 and the lower mold die2061 when the mold 2060 is formed.

In the process shown in FIG. 14B, the softened mold resin 2060 b issupplied to a space surrounded by a side wall of the lower mold die2061. First, a nozzle 2063 for supplying the mold resin 2060 b isarranged above the lower mold die 2061 (between the upper mold die 2062and the side wall of the lower mold die 2061). Then, the mold resin 2060b is supplied from the nozzle 2063 to the inside of the lower mold die2061.

The mold resin 2060 b is silicon-based resin, for example, as describedabove. Specifically, it is preferable to use silicon-based resin whichadheres to quartz and is hardened at room temperature. The amount ofmold resin 2060 b is adjusted such that at least the upper surface ofthe second light-transmitting plate 57 arranged on the facing substrate52 is buried in the mold resin 2060 b.

By forming the mold 2060 up to a level in which the upper surface of thesecond light-transmitting plate 57 is buried in the mold 2060 asdescribed above, it is possible to extend the length of the interfacebetween the second light-transmitting plate 57 and the mold 2060. Inother words, it is possible to extend the distance from a portion of thesecond light transmitting plate 57, which is in contact with ambientair, to the sealing material 407 and to thereby suppress entry ofmoisture into the liquid crystal layer 450 via the sealing material 407.

In addition, it is preferable to perform fluorine coating processing onthe surface of the mold 2060 after forming the mold 2060 in the outercircumference of the liquid crystal panel 40. With such a configuration,it is possible to suppress transmission of moisture through the mold2060 and entry of the moisture into the liquid crystal layer 450.

In addition, since the first hook 2041 a is arranged at the contactportion between the lower mold die 2061 and the liquid crystal panel 40and the second hook 2041 b is arranged at the contact portion betweenthe upper mold die 2062 and the liquid crystal panel 40, it is possibleto prevent the mold dies from being brought into direct contact with theliquid crystal panel 40 and to thereby prevent contact scratch frombeing generated in the liquid crystal panel 40 (the firstlight-transmitting plate 56 and the second light-transmitting plate 57).

As described above in detail, it is possible to achieve the followingadvantages by the liquid crystal device 2000, the method ofmanufacturing the liquid crystal device 2000, and the electronicapparatus according to this embodiment.

(1) According to the liquid crystal device 2000 and the method ofmanufacturing the liquid crystal device 2000 in the second embodiment,the mold 2060 is formed so as to cover the region from the surface ofthe first light-transmitting plate 56 on the opposite side to the liquidcrystal layer 450 to the surface of the second light-transmitting plate57 on the opposite side to the liquid crystal layer 450, and therefore,it is possible to extend the length of the interface between the mold2060 and the substrates (the element substrate 51, the facing substrate52, the first light-transmitting plate 56, and the secondlight-transmitting plate 57). For this reason, it is possible tosuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407. In addition, since the mold 2060is formed to have a large thickness, it is possible to improve moistureresistance. As a result, it is possible to suppress deterioration in theliquid crystal layer 450 and to suppress degradation in display qualitydue to a degraded controllability (responsiveness) of the liquidcrystal.

(2) According to the liquid crystal device 2000 and the method ofmanufacturing the liquid crystal device 2000 in the second embodiment,the coating processing is performed on the surface of the mold 2060, andtherefore, it is possible to suppress transmittance of moisture throughthe mold 2060 and entry of the moisture into the liquid crystal layer450.

(3) According to the liquid crystal device 2000 and the method ofmanufacturing the liquid crystal device 2000 in the second embodiment,the mold 2060 with a function as a frame is used instead of a metalframe which is used in the related art, and therefore, it is possible toemploy a frame-less configuration and to suppress the cost. In addition,it is possible to reduce the weight by employing the mold 2060.

(4) According to the liquid crystal device 2000 and the method ofmanufacturing the liquid crystal device 2000 in the second embodiment,the first hook 2041 a and the second hook 2041 b are provided as partingunits at the first light-transmitting plate 56 and the secondlight-transmitting plate 57 near the liquid crystal panel 40, andtherefore, it is possible to improve parting accuracy. In addition,since the first hook 2041 a and the second hook 2041 b are arranged atsuch portions so as to be brought into contact with the lower mold die2061 and the upper mold die 2062 when the mold 2060 is formed, it ispossible to prevent the mold dies (the upper mold die 2062 and the lowermold die 2061) from being brought into direct contact with the liquidcrystal panel 40 and to thereby prevent contact scratch from beinggenerated in the liquid crystal panel 40 (the first light-transmittingplate 56 and the second light-transmitting plate 57).

(5) According to the electronic apparatus in the second embodiment, theabove liquid crystal device 2000 is provided therein, and therefore, itis possible to provide an electronic apparatus capable of improvingdisplay quality and suppressing deterioration in the liquid crystallayer 450.

Modification Example 6

The invention is not limited to the above configuration in which onlythe mold 2060 functioning as a frame is formed in the outercircumference of the liquid crystal panel 40, and the configurationshown in FIG. 15 may be employed. FIG. 15 is a cross-sectional viewschematically showing a configuration of a liquid crystal deviceaccording to a modification example. The liquid crystal device shown inFIG. 15 is different from those in the above embodiments andmodification examples in that a light-blocking third hook 2071functioning as a parting unit is arranged on the mold 2060 along withthe first hook 2041 a and the second hook 2041 b.

The third hook 2071 is arranged on the light incident side with respectto the mold 2060 and is used as a parting unit for limiting the range ofthe light which is incident on the liquid crystal panel 40. The thirdhook 2071 is a metal plate, for example. The third hook 2071 is providedwith an opening hole which is overlapped with the opening region of themold 2060. The opening hole of the third hook 2071 is smaller than theopening hole of the mold 2060.

The third hook 2071 is made of a material with higher heat conductivitythan those of the second light-transmitting plate 57 and the liquidcrystal panel 40 (the element substrate 51 and the facing substrate 52).More specifically, the third hook 2071 is made of metal such as aluminumor copper. Therefore, the third hook 2071 also functions as a heatreleasing member for releasing the heat, which is generated at theliquid crystal panel 40, via the mold 2060. In addition, black colortreatment is performed on the surface of the third hook 2071 in order tosuppress reflection of light.

The mold 2060 and the third hook 2071 may be fixed to each other with anadhesive agent, for example, or may be fixed to each other by fitting aconvex portion of the mold 2060 into a concave portion of the third hook2071.

With such a configuration, the light-blocking third hook 2071 isarranged so as to surround the image display region 40 a, and therefore,it is possible to limit the range of the light which is incident on theimage display region 40 a. In other words, it is possible to block lightwhich is unnecessarily incident on the region.

In addition, the invention is not limited to the arrangement of thethird hook 2071 on the side of the facing substrate 52, and the thirdhook 2071 may also be arranged on the side of the element substrate 51.

Modification Example 7

The invention is not limited to the above configuration in which onlythe mold 2060 functioning as a frame is formed in the outercircumference of the liquid crystal panel 40 or the configuration ofproviding the third hook 2071 as in Modification Example 6, and theconfiguration shown in FIG. 16 may be employed. FIG. 16 is across-sectional view schematically showing a configuration of a liquidcrystal device according to Modification Example 7. The liquid crystaldevice shown in FIG. 16 is different from those in the above embodimentsand modification examples in that the light-blocking third hook 2071functioning as a parting unit is provided above the mold 2060 along withthe first hook 2041 a and the second hook 2041 b and a case 2072 as aframe body is provided below the mold 2060.

The third hook 2071 is configured in the same manner as that inModification Example 6, for example. The case 2072 is a metal materialsuch as aluminum or magnesium and is arranged so as to surround the mold2060 and be in contact with the liquid crystal panel 40 via the firsthook 2041 a.

Fixation between the mold 2060 and the third hook 2071 and fixationbetween the mold 2060 and the case 2072 may be established with anadhesive agent or may be established by fitting these components to eachother as described above.

According to this modification example, the case 2072 is arranged so asto be in contact with the liquid crystal panel 40 via the first hook2041 a, and therefore, it is possible to prevent contact scratch frombeing generated in the lower mold die 2061 of the liquid crystal panel40 (first light-transmitting plate 56) and to efficiently release theheat accumulated in the liquid crystal panel 40. In addition, since theheat in the liquid crystal layer 450 is released, it is possible tosuppress a decrease in lifetime of the liquid crystal layer 450(lifetime of the liquid crystal panel 40).

Modification Example 7

The invention is not limited to the above configuration in which themold 2060 is formed in the outer circumference of the liquid crystalpanel 40 by supplying (dripping) the mold resin 2060 b to the lower molddie 2061, and the mold 2060 may be formed by a transfer mold scheme, forexample. At this time, it is preferable to employ mold resin 2060 bcapable of forming the mold 2060 at a temperature which does not affectthe liquid crystal panel 40.

Modification Example 8

As for electronic apparatuses on which the liquid crystal device 2000 ismounted as described above, it is possible to use the liquid crystaldevice for various electronic apparatuses such as an electrical viewfinder (EVF), a mobile mini projector, a head-up display, a smart phone,a mobile phone, a mobile computer, a digital camera, a digital videocamera, a display, a vehicle-mounted device, an audio device, anexposure device, and an illumination device as well as theprojection-type display apparatus 1.

Modification Example 9

The invention is not limited to the application of the liquid crystaldevice 2000 as the electro-optic device as described above, and theelectro-optic device may be applied to an organic EL device, a plasmadisplay, or an electronic paper (EPD), for example. In a case of aliquid crystal device, for example, an electro-optic material is liquidcrystal. In a case of an electronic paper, the electro-optic material isan electrophoretic material.

Third Embodiment

Hereinafter, a third embodiment in which an example of the invention isimplemented will be described with reference to drawings. In addition,the drawings to be used are appropriately shown in an enlarged manner orin a contracted manner such that parts to be described can berecognized. Furthermore, since the third embodiment is configured in thesame manner as in the first embodiment other than that the configurationof the liquid crystal device 1000 and the method of manufacturing theliquid crystal device as the electro-optic device according to theaforementioned first embodiment are different, the same referencenumerals will be given to the same constituent elements as those in thefirst embodiment, and the descriptions thereof will be omitted.

In this embodiment, a configuration of the electronic apparatus, adetailed configuration of the optical unit, and a configuration of theelectro-optic panel are the same as those according to theaforementioned first embodiment. However, when the liquid crystal panels40(R), 40(G), and 40(B) are mounted on the optical unit 9 shown in FIGS.17 and 18, the liquid crystal panels 40(R), 40(G), and 40(B) are mountedin a state of being provided in liquid crystal devices 3000(R), 3000(G),and 3000(B), which will be described later, respectively.

The liquid crystal panels 40(R), 40(G), and 40(B) have the sameconfiguration, and the liquid crystal devices 3000(R), 3000(G), and3000(B) for the red color (R), the green color (G), and the blue color(B) provided with the liquid panels 40(R), 40(G), and 40(B) also havethe same configuration. Therefore, the following description will begiven without adding (R), (G), and (B) which represent correspondingcolors.

Configuration of Electro-Optic Device

FIG. 19 is a perspective view schematically showing a configuration of aliquid crystal device as the electro-optic device. FIG. 20 is aschematic cross-sectional view taken along line XX-XX in the liquidcrystal device shown in FIG. 19. Hereinafter, the configuration of theliquid crystal device will be described with reference to FIGS. 19 and20. In FIG. 20, depiction and description of the flexible wiringsubstrate 90 are omitted.

When the liquid crystal panel 40 described above with reference to FIGS.4A and 4B is mounted on the projection-type display apparatus 1 and theoptical unit 9 described above with reference to FIGS. 1A, 1B, 17, and18, the flexible wiring substrate 90 is connected to the liquid crystalpanel 40, and the liquid crystal device 3000 in which a mold 3060 isarranged so as to cover the outer circumference of the liquid crystalpanel 40 for the purpose of moisture resistance and reinforcement isthen obtained as shown in FIGS. 19 and 20.

Specifically, the mold 3060 is a resin member which includes arectangular opening hole at the center thereof and has an outer shapefunctioning as a frame, and accommodates the liquid crystal panel 40therein. The mold 3060 is formed of silicon-based resin, for example.

As shown in FIG. 20, the mold 3060 is provided so as to cover a regionfrom the surface of the first light-transmitting plate 56 as a thirdsubstrate on the opposite side to the liquid crystal layer 450 to thesurface of the second light-transmitting plate 57 as the third substrateon the opposite side to the liquid crystal layer 450. Specifically, themold 3060 is provided so as to cover up to the region overlapped withthe sealing material 407 in a plan view. The opening hole is opened suchthat the mold 3060 is not arranged in at least a region overlapped withthe image display region 40 a.

As shown in FIGS. 4A, 4B, 19, and 20, the first light-transmitting plate56 is attached to the second surface 51 b of the element substrate 51(outer surface; the surface of the element substrate 51 on the oppositeside to the facing substrate 52) with an adhesive agent or the like, andthe second light-transmitting plate 57 is attached to the second surface52 b of the facing substrate 52 (outer surface; the surface of thefacing substrate 52 on the opposite side to the element substrate 51)with an adhesive agent or the like in the liquid crystal panel 40 forconfiguring the liquid crystal device 3000 by using the liquid crystalpanel 40 according to this embodiment.

Since the first light-transmitting plate 56 and the secondlight-transmitting plate 57 have the same configurations as those in theaforementioned first embodiment, the descriptions thereof will beomitted.

As shown in FIG. 19, opening holes 3060 a for arranging the liquidcrystal device 3000 in the aforementioned projection-type displayapparatus 1 are provided at four corners of the upper surface of themold 3060. In addition, the invention is not limited to the openingholes 3060 a, and screw holes may be formed.

In addition, coating processing to provide liquid repellency isperformed on the surface of the mold 3060. Examples of the coatingprocessing include fluorine coating.

Since the mold 3060 is provided so as to cover the region from thesurface of the first light-transmitting plate 56 on the opposite side tothe liquid crystal layer 450 to the surface of the secondlight-transmitting plate 57 on the opposite side to the liquid crystallayer 450 as described above, it is possible to extend the length L1 ofthe interface between the mold 3060 and the substrates (the elementsubstrate 51, the facing substrate 52, the first light-transmittingplate 56, and the second light-transmitting plate 57). Therefore, it ispossible to suppress entry of moisture into the liquid crystal layer 450via the interface and the sealing material 407.

In addition, since the fluorine coating processing is performed on thesurface of the mold 3060, it is possible to suppress transmittance ofmoisture through the mold 3060 and entry of the moisture into the liquidcrystal layer 450.

In addition, a first support seal 3041 a which includes an openingportion in a region overlapped with the image display region 40 a isarranged between the surface of the first light-transmitting plate 56and the mold 3060. In contrast, a second support seal 3041 b whichincludes an opening portion in a region overlapped with the imagedisplay region 40 a is arranged between the surface of the secondlight-transmitting plate 57 and the mold 3060.

The first support seal 3041 a and the second support seal 3041 b arepreferably configured of a film-shaped flexible material, and areconfigured of vinyl chloride, polyimide film, or polyester (PET), forexample. Alternatively, the first support seal 3041 a and the secondsupport seal 3041 b may be configured of rubber or the like.

The first support seal 3041 a and the second support seal 3041 b areused to prevent contact scratch from being generated in the liquidcrystal panel 40 when the mold dies are arranged in the circumference ofthe liquid crystal panel 40 for forming the mold 3060 in the outercircumference of the liquid crystal panel 40.

Method of Manufacturing Electro-Optic Device

FIGS. 21A and 21B are cross-sectional views schematically showing amethod of manufacturing a liquid crystal device as the electro-opticdevice. Particularly, FIGS. 21A and 21B are cross-sectional viewsschematically showing a mold as a frame of the liquid crystal device.Hereinafter, the method of manufacturing the mold will be described withreference to FIGS. 21A and 21B.

In the process shown in FIG. 21A, the liquid crystal panel 40 isarranged in mold dies (an upper mold die 3062 and a lower mold die3061). First, the concave-shaped lower mold die 3061 is arranged. At abottom portion 3061 b of the lower mold die 3061, a convex portion 3061a for arranging the liquid crystal panel 40 is arranged.

Next, the first light-transmitting plate 56 is arranged on the surfaceof the element substrate 51 on the opposite side to the liquid crystallayer 450 in the liquid crystal panel 40. In addition, the secondlight-transmitting plate 57 is arranged on the surface of the facingsubstrate 52 on the opposite side to the liquid crystal layer 450.

Then, the liquid crystal panel 40 is arranged on the convex portion 3061a via the first support seal 3041 a. Thereafter, the upper mold die 3062is arranged on the liquid crystal panel 40 via the second support seal3041 b. Specifically, the convex portion 3061 a and the firstlight-transmitting plate 56 are arranged so as to face each other, andthe second light-transmitting plate 57 and the upper mold die 3062 arearranged so as to face each other.

The first support seal 3041 a and the second support seal 3041 b may bea type of being attached to the liquid crystal panel 40 or may be a typeof being formed on the liquid crystal panel 40 by using a semiconductormanufacturing technology.

According to this embodiment, the mold dies are in contact with theliquid crystal panel 40 via the first support seal 3041 a and the secondsupport seal 3041 b even if the mold dies (the upper mold die 3062 andthe lower mold die 3061) have a degree of flatness with low accuracy oreven if burr occurs in the mold dies. Therefore, it is possible toprevent the liquid crystal panel 40 (the first light-transmitting plate56 and the second light-transmitting plate 57) from being scratched andto prevent the mold resin 3060 b from flowing into the image displayregion 40 a.

In addition, it is possible to suppress entry of moisture into theliquid crystal panel 40 by using the first support seal 3041 a and thesecond support seal 3041 b with no force of penetration.

In addition, it is desirable to attach a third support seal 3041 c to anopening portion surrounded by the first support seal 3041 a, namely tothe image display region 40 a of the liquid crystal panel 40. Moreover,it is desirable to attach a fourth support seal 3041 d to an openingportion surrounded by the second support seal 3041 b, namely to theimage display region 40 a of the liquid crystal panel 40.

With such a configuration, it is possible to prevent dust and the likefrom adhering to the image display region 40 a of the liquid crystalpanel 40. In other words, it is possible to protect the display surface.

In addition, it is desirable to form Teflon on the surface of the uppermold die 3062 and the surface of the lower mold die 3061. Specifically,Teflon is formed at least in portions, at which the upper mold die 3062and the lower mold die 3061 are brought into contact with the mold resin3060 b, of the upper mold die 3062 and the lower mold die 3061. Withsuch a configuration, it is possible to facilitate separation of themold 3060 from the upper mold die 3062 and the lower mold die 3061 whenthe mold 3060 is formed.

In the process shown in FIG. 21B, the softened mold resin 3060 b issupplied to a space surrounded by a side wall of the lower mold die3061. First, a nozzle 3063 for supplying the mold resin 3060 b isarranged above the lower mold die 3061 (between the upper mold die 3062and the side wall of the lower mold die 3061). Then, the mold resin 3060b is supplied from the nozzle 3063 to the inside of the lower mold die3061.

The mold resin 3060 b is silicon-based resin, for example, as describedabove. Specifically, it is preferable to use silicon-based resin whichadheres to quartz and is hardened at room temperature. The amount ofmold resin 3060 b is adjusted such that at least the upper surface ofthe second light-transmitting plate 57 arranged on the facing substrate52 is buried in the mold resin 3060 b.

By forming the mold 3060 up to a level in which the upper surface of thesecond light-transmitting plate 57 is buried in the mold 3060 asdescribed above, it is possible to extend the length of the interfacebetween the second light-transmitting plate 57 and the mold 3060. Inother words, it is possible to extend the distance from a portion of thesecond light transmitting plate 57, which is in contact with ambientair, to the sealing material 407 and to thereby suppress entry ofmoisture into the liquid crystal layer 450 via the sealing material 407.

In addition, it is preferable to perform fluorine coating processing onthe surface of the mold 3060 after forming the mold 3060 in the outercircumference of the liquid crystal panel 40. With such a configuration,it is possible to suppress transmission of moisture through the mold3060 and entry of the moisture into the liquid crystal layer 450.

Since the first support seal 3041 a is arranged at the contact portionbetween the lower mold die 3061 and the liquid crystal panel 40 and thesecond support seal 3041 b is arranged at the contact portion betweenthe upper mold die 3062 and the liquid crystal panel 40, it is possibleto prevent the mold dies from being brought into direct contact with theliquid crystal panel 40 and to thereby prevent contact scratch frombeing generated in the liquid crystal panel 40 (the firstlight-transmitting plate 56 and the second light-transmitting plate 57).

In addition, it is only necessary for the first support seal 3041 a andthe second support seal 3041 b to function during the filling of themold resin 3060 b, and the first support seal 3041 a and the secondsupport seal 3041 b may be left in the attached state to the liquidcrystal panel 40 or may be peeled off after forming the mold 3060.Moreover, the third support seal 3041 c and the fourth support seal 3041d can protect the display surface by being left until the electro-opticdevice is used as a product.

As described above in detail, it is possible to achieve the followingadvantages by the liquid crystal device 3000, the method ofmanufacturing the liquid crystal device 3000, and the electronicapparatus according to this embodiment.

(1) According to the liquid crystal device 3000 and the method ofmanufacturing the liquid crystal device 3000 in the third embodiment,the mold 3060 is formed so as to cover the region from the surface ofthe first light-transmitting plate 56 on the opposite side to the liquidcrystal layer 450 to the surface of the second light-transmitting plate57 on the opposite side to the liquid crystal layer 450, and therefore,it is possible to extend the length of the interface between the mold3060 and the substrates (the element substrate 51, the facing substrate52, the first light-transmitting plate 56, and the secondlight-transmitting plate 57). For this reason, it is possible tosuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407. In addition, since the mold 3060is formed to have a large thickness, it is possible to improve moistureresistance. As a result, it is possible to suppress deterioration in theliquid crystal layer 450 and to suppress degradation in display qualitydue to a degraded controllability (responsiveness) of the liquidcrystal.

(2) According to the liquid crystal device 3000 and the method ofmanufacturing the liquid crystal device 3000 in the third embodiment,the coating processing is performed on the surface of the mold 3060, andtherefore, it is possible to suppress transmittance of moisture throughthe mold 3060 and entry of the moisture into the liquid crystal layer450.

(3) According to the liquid crystal device 3000 and the method ofmanufacturing the liquid crystal device 3000 in the third embodiment,the mold 3060 with a function as a frame is used instead of a metalframe which is used in the related art, and therefore, it is possible toemploy a frame-less configuration and to suppress the cost. In addition,it is possible to reduce the weight by employing the mold 3060.

(4) According to the method of manufacturing the liquid crystal device3000 in the third embodiment, the first support seal 3041 a and thesecond support seal 3041 b are arranged at such portions so as to bebrought into contact with the lower mold die 3061 and the upper mold die3062 when the mold 3060 is formed, and therefore, it is possible toprevent the mold dies from being brought into direct contact with theliquid crystal panel 40 and to thereby prevent contact scratch frombeing generated in the liquid crystal panel 40 (the firstlight-transmitting plate 56 and the second light-transmitting plate 57).

(5) According to the electronic apparatus in the third embodiment, theabove liquid crystal device 3000 is provided therein, and therefore, itis possible to provide an electronic apparatus capable of improvingdisplay quality and suppressing deterioration in the liquid crystallayer 450.

Modification Example 10

The invention is not limited to the above configuration in which onlythe mold 3060 functioning as a frame is formed in the outercircumference of the liquid crystal panel 40, and the configurationshown in FIG. 22 may be employed. FIG. 22 is a cross-sectional viewschematically showing a configuration of a liquid crystal deviceaccording to a modification example. The liquid crystal device shown inFIG. 22 is different from those in the above embodiments andmodification examples in that a light-blocking hook 3071 functioning asa parting unit is arranged on the mold 3060 along with the first supportseal 3041 a and the second support seal 3041 b.

The hook 3071 is arranged on the light incident side with respect to themold 3060 and is used as a parting unit for limiting the range of thelight which is incident on the liquid crystal panel 40. The hook 3071 isa metal plate, for example. The hook 3071 is provided with an openinghole which is overlapped with the opening region of the mold 3060. Theopening hole of the hook 3071 is smaller than the opening hole of themold 3060.

The hook 3071 is made of a material with higher heat conductivity thanthose of the second light-transmitting plate 57 and the liquid crystalpanel 40 (the element substrate 51 and the facing substrate 52). Morespecifically, the hook 3071 is made of metal such as aluminum or copper.Therefore, the hook 3071 also functions as a heat releasing member forreleasing the heat, which is generated at the liquid crystal panel 40,via the mold 3060. In addition, black color treatment is performed onthe surface of the hook 3071 in order to suppress reflection of light.

Fixation between the mold 3060 and the hook 3071 may be established withan adhesive agent, for example, or may be established by fitting aconvex portion of the mold 3060 into a concave portion of the hook 3071.

According to this modification example, the light-blocking hook 3071 isarranged so as to surround the image display region 40 a, and therefore,it is possible to limit the range of the light which is incident on theimage display region 40 a. In other words, it is possible to block lightwhich is unnecessarily incident on the region.

In addition, the invention is not limited to the arrangement of the hook3071 on the side of the facing substrate 52, and the hook 3071 may alsobe arranged on the side of the element substrate 51.

Modification Example 11

The invention is not limited to the above configuration in which onlythe mold 3060 functioning as a frame is formed in the outercircumference of the liquid crystal panel 40 the configuration ofarranging the hook 3071 as in Modification Example 10, and theconfiguration shown in FIG. 23 may be employed. FIG. 23 is across-sectional view schematically showing a configuration of a liquidcrystal device according to Modification Example 11. The liquid crystaldevice shown in FIG. 23 is different from those in the above embodimentsand modification examples in that the hook 3071 is arranged above themold 3060 along with the first support seal 3041 a and the secondsupport seal 3041 b and a case 3072 as a frame body is provided belowthe mold 3060.

The hook 3071 is configured in the same manner as that in ModificationExample 10, for example. The case 3072 is a metal material such asaluminum or magnesium and is arranged so as to surround the mold 3060and be in contact with the first support seal 3041 a and the liquidcrystal panel 40.

Fixation between the mold 3060 and the hook 3071 and fixation betweenthe mold 3060 and the case 3072 may be established with an adhesiveagent or may be established by fitting these components to each other asdescribed above.

According to this modification example, the case 3072 is arranged so asto be in contact with the first support seal 3041 a and the liquidcrystal panel 40, and therefore, it is possible to prevent contactscratch from being generated in the lower mold die 2061 of the liquidcrystal panel 40 (first light-transmitting plate 56) and to efficientlyrelease the heat accumulated in the liquid crystal panel 40. Inaddition, since the heat in the liquid crystal layer 450 is released, itis possible to suppress a decrease in lifetime of the liquid crystallayer 450 (lifetime of the liquid crystal panel 40).

Modification Example 12

The invention is not limited to the above configuration in which themold 3060 is formed in the outer circumference of the liquid crystalpanel 40 by supplying (dripping) the mold resin 3060 b to the lower molddie 3061, and the mold 3060 may be formed by a transfer mold scheme, forexample. At this time, it is preferable to employ mold resin 3060 bcapable of forming the mold 3060 at a temperature which does not affectthe liquid crystal panel 40.

Modification Example 13

As for electronic apparatuses on which the liquid crystal device 3000 ismounted as described above, it is possible to use the liquid crystaldevice for various electronic apparatuses such as an electrical viewfinder (EVF), a mobile mini projector, a head-up display, a smart phone,a mobile phone, a mobile computer, a digital camera, a digital videocamera, a display, a vehicle-mounted device, an audio device, anexposure device, and an illumination device as well as theprojection-type display apparatus 1.

Modification Example 14

The invention is not limited to the application of the liquid crystaldevice 3000 as the electro-optic device as described above, and theelectro-optic device may be applied to an organic EL device, a plasmadisplay, or an electronic paper (EPD), for example. In a case of aliquid crystal device, for example, an electro-optic material is liquidcrystal. In a case of an electronic paper, the electro-optic material isan electrophoretic material.

Fourth Embodiment

Hereinafter, a fourth embodiment in which an example of the invention isimplemented will be described with reference to drawings. In addition,the drawings to be used are appropriately shown in an enlarged manner orin a contracted manner such that parts to be described can berecognized. Furthermore, since the fourth embodiment is configured inthe same manner as in the first embodiment other than that theconfiguration of the liquid crystal device 1000 and the method ofmanufacturing the liquid crystal device as the electro-optic deviceaccording to the aforementioned first embodiment are different, the samereference numerals will be given to the same constituent elements asthose in the first embodiment, and the descriptions thereof will beomitted.

In this embodiment, a configuration of the electronic apparatus, adetailed configuration of the optical unit, and a configuration of theelectro-optic panel are the same as those according to theaforementioned first embodiment. However, when the liquid crystal panels40(R), 40(G), and 40(B) are mounted on the optical unit 9 shown in FIGS.24 and 25, the liquid crystal panels 40(R), 40(G), and 40(B) are mountedin a state of being provided in liquid crystal devices 4000(R), 4000(G),and 4000(B), which will be described later, respectively.

The liquid crystal panels 40(R), 40(G), and 40(B) have the sameconfiguration, and the liquid crystal devices 4000(R), 4000(G), and4000(B) for the red color (R), the green color (G), and the blue color(B) provided with the liquid panels 40(R), 40(G), and 40(B) also havethe same configuration. Therefore, the following description will begiven without adding (R), (G), and (B) which represent correspondingcolors.

Configuration of Electro-Optic Device

FIG. 26 is a perspective view schematically showing a configuration of aliquid crystal device as the electro-optic device. FIG. 27 is aschematic cross-sectional view taken along line XXVII-XXVII in theliquid crystal device shown in FIG. 26. Hereinafter, the configurationof the liquid crystal device will be described with reference to FIGS.26 and 27. In FIG. 27, depiction and description of the flexible wiringsubstrate 90 are omitted.

When the liquid crystal panel 40 described above with reference to FIGS.4A and 4B is mounted on the projection-type display apparatus 1described above with reference to FIGS. 1A, 1B, 24, and 25 and theoptical unit 9, the flexible wiring substrate 90 is connected to theliquid crystal panel 40, and the liquid crystal device 4000 in which amold 4060, a frame 4071, and a hook 4072 are arranged so as to cover theouter circumference of the liquid crystal panel 40 for the purpose ofmoisture resistance and reinforcement is then obtained as shown in FIGS.26 and 27.

As shown in FIGS. 4A, 4B, and 27, the first light-transmitting plate 56is attached to the second surface 51 b of the element substrate 51(outer surface; the surface on the opposite side to the liquid crystallayer 450) with an adhesive agent or the like, and the secondlight-transmitting plate 57 is attached to the second surface 52 b ofthe facing substrate 52 (outer surface; the surface on the opposite sideto the liquid crystal layer 450) with an adhesive agent or the like inthe liquid crystal panel 40.

Since the first light-transmitting plate 56 and the secondlight-transmitting plate 57 have the same configurations as those in theaforementioned first embodiment, the descriptions thereof will beomitted.

The frame 4071 is formed into substantially a concave shape so as tosurround the liquid crystal panel 40 and includes an opening hole at thecenter of the bottom surface thereof. Specifically, a wholecircumference of one end 4071 a which forms the opening hole of theframe 4071 is bent so as to be directed upward with respect to thebottom surface. That is, the whole circumference of the one end 4071 ais arranged so as to be in contact with the surface of the firstlight-transmitting plate 56 on the opposite side to the liquid crystallayer 450 in the liquid crystal panel 40. In addition, the frame 4071 iscaulked or bonded such that mold resin which will be described laterdoes not leak from a gap caused between the one end 4071 a and the firstlight-transmitting plate 56.

The other end 4071 b of the frame 4071 is arranged so as to extend to anupper position than the upper surface of the second light-transmittingplate 57 of the liquid crystal panel 40 and surround the liquid crystalpanel 40 as a whole. Specifically, a support seal 4041 is arranged onthe upper surface of the second light-transmitting plate 57 so as tosurround the image display region 40 a. The other end 4071 b of theframe 4071 is arranged so as to extend to an upper position than theupper surface of the support seal 4041.

The frame 4071 is configured of a metal material such as aluminum ormagnesium. The frame 4071 is used for forming the mold 4060 and canefficiently release the heat accumulated in the liquid crystal panel 40by being arranged so as to be in contact with the liquid crystal panel40. In addition, since the frame 4071 releases the heat in the liquidcrystal layer 450, it is possible to suppress a decrease in lifetime ofthe liquid crystal layer 450 (lifetime of the liquid crystal panel 40).

The mold 4060 is arranged between the liquid crystal panel 40 and theframe 4071. The mold 4060 is formed of silicon-based resin, for example.The mold 4060 is arranged so as to cover a region from the surface ofthe first light-transmitting plate 56 on the opposite side to the liquidcrystal layer 450 to the surface of the second light-transmitting plate57 on the opposite side to the liquid crystal layer 450.

Specifically, the support seal 4041 is arranged on the surface of thesecond light-transmitting plate 57 so as to surround the image displayregion 40 a as described above. The height position of the upper surfaceof the mold 4060 is arranged so as to be located between the uppersurface and the lower surface of the support seal 4041.

The hook 4072 is provided above the frame 4071 so as to cover the entireregion surrounded by the frame 4071 and is fixed thereto with anadhesive agent. In addition, an opening hole 4072 a which opens in aregion overlapped with the image display region 40 a is formed in thehook 4072. The hook 4072 is arranged on the light incident side and isused as a parting unit for limiting the range of the light which isincident on the liquid crystal panel 40.

The hook 4072 is a metal plate, for example. The hook 4072 is configuredof a material with higher heat conductivity than those of the firstlight-transmitting plate 56, the second light-transmitting plate 57, andthe liquid crystal panel 40 (the element substrate 51 and the facingsubstrate 52). More specifically, the hook 4072 is made of metal such asaluminum or copper. In addition, black color treatment is performed onthe surface of the hook 4072 in order to suppress reflection of light.

Since the light-blocking hook 4072 is arranged so as to surround theimage display region 40 a as described above, it is possible to limitthe range of the light which is incident on the image display region 40a. In other words, it is possible to block light which is unnecessarilyincident on the region.

In addition, since the mold 4060 is arranged so as to cover the regionfrom the surface of the first light-transmitting plate 56 on theopposite side to the liquid crystal layer 450 to the surface of thesecond light-transmitting plate 57 on the opposite side to the liquidcrystal layer 450, it is possible to extend the length of the interfacebetween the mold 4060 and the substrates (the element substrate 51, thefacing substrate 52, the first light-transmitting plate 56, and thesecond light-transmitting plate 57). Therefore, it is possible tosuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407.

Method of Manufacturing Electro-Optic Device

FIGS. 28A, 28B, 29A, and 29B are cross-sectional views schematicallyshowing a method of manufacturing a liquid crystal device as theelectro-optic device. Particularly, FIGS. 28A, 28B, 29A, and 29B arecross-sectional views schematically showing a method of manufacturing aframe, a mold, and a hook which configure the liquid crystal device.Hereinafter, the method of manufacturing a liquid crystal device will bedescribed with reference to FIGS. 28A, 28B, 29A, and 29B.

In the process shown in FIG. 28A, the support seal 4041 is attached tothe liquid crystal panel 40. Specifically, the support seal 4041 isattached so as to surround the image display region 40 a on the uppersurface (the surface on the opposite side to the liquid crystal layer450) of the second light-transmitting plate 57.

In the process shown in FIG. 28B, the liquid crystal panel 40 isarranged in the frame 4071. Specifically, the liquid crystal panel 40 isarranged on the one end 4071 a, which forms the opening hole atsubstantially the center of the frame 4071, of the frame 4071. At thistime, the liquid crystal panel 40 is arranged such that the opening holeof the frame 4071 surrounds the image display region 40 a of the liquidcrystal panel 40 in a plan view.

In the process shown in FIG. 29A, a softened mold resin 4060 b issupplied to the space surrounded by the frame 4071. First, a nozzle 4063for supplying the mold resin 4060 b is arranged between the frame 4071and the liquid crystal panel 40. Then, the mold resin 4060 b is suppliedfrom the nozzle 4063 to the inside of the frame 4071.

The mold resin 4060 b is silicon-based resin, for example, as describedabove. Specifically, it is preferable to use silicon-based resin whichadheres to quartz and is hardened at room temperature. The amount ofmold resin 4060 b is adjusted such that at least the outside of thesupport seal 4041 on the upper surface of the second light-transmittingplate 57 arranged on the facing substrate 52 is buried in the mold resin4060 b. In other words, it is preferable to supply the mold resin 4060 bsuch that the upper surface of the mold 4060 is located between theupper surface and the lower surface of the support seal 4041.

According to this embodiment, the support seal 4041 is arranged on theupper surface of the second light-transmitting plate 57, and therefore,it is possible to cover a part of the upper surface of the secondlight-transmitting plate 57 with the mold resin 4060 b and to preventthe mold resin 4060 b from flowing to the side of the image displayregion 40 a.

By forming the mold 4060 up to a level in which the upper surface of thesecond light-transmitting plate 57 is buried in the mold 4060, it ispossible to extend the length of the interface between the secondlight-transmitting plate 57 and the mold 4060. In other words, it ispossible to extend the distance from a portion of the second lighttransmitting plate 57, which is in contact with ambient air, to thesealing material 407 and to thereby suppress entry of moisture into theliquid crystal layer 450 via the sealing material 407.

In the process shown in FIG. 29B, the hook 4072 is placed over the frame4071 and fixed thereto. The opening hole 4072 a is formed at the centerof the hook 4072 as described above. Therefore, it is possible to limitthe range of the light which is incident on the image display region 40a.

As described above in detail, it is possible to achieve the followingadvantages by the liquid crystal device 4000, the method ofmanufacturing the liquid crystal device 4000, and the electronicapparatus according to this embodiment.

(1) According to the liquid crystal device 4000 in the fourthembodiment, the mold 4060 covers the region in the circumference of theliquid crystal panel 40 from the surface of the first light-transmittingplate 56 on the opposite side to the liquid crystal layer 450 to thesurface of the second light-transmitting plate 57 on the opposite sideto the liquid crystal layer 450, which are surrounded by the frame 4071,and therefore, it is possible to extend the length of the interfacebetween the substrates (the element substrate 51, the facing substrate52, the first light-transmitting plate 56, and the secondlight-transmitting plate 57) and the mold 4060. For this reason, it ispossible to suppress entry of moisture into the liquid crystal layer 450via the interface and the sealing material 407. In addition, since themold 4060 is formed to have a large thickness, it is possible to improvemoisture resistance. As a result, it is possible to suppressdeterioration in the liquid crystal layer 450 and to suppressdegradation in display quality due to a degraded controllability(responsiveness) of the liquid crystal.

(2) According to the method of manufacturing the liquid crystal device4000 in the fourth embodiment, the mold resin 4060 b is supplied betweenthe frame 4071 and the liquid crystal panel 40, and therefore, it ispossible to cover the circumference of the liquid crystal panel 40 withthe mold 4060. For this reason, it is possible to extend the length ofthe interface between the substrates (the element substrate 51, thefacing substrate 52, the first light-transmitting plate 56, and thesecond light-transmitting plate 57) and the mold 4060 and to therebysuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407.

(3) According to the method of manufacturing the liquid crystal device4000 in the fourth embodiment, the mold resin 4060 b is supplied suchthat the height position of the upper surface of the mold 4060 islocated between the upper surface and the lower surface of the supportseal 4041, and therefore, it is possible to cover at least the region inthe circumference of the liquid crystal panel 40 from a part of thesurface of the first light-transmitting plate 56 on the opposite side tothe liquid crystal layer 450 to the support seal 4041 on the surface ofthe second light-transmitting plate 57 on the opposite side to theliquid crystal layer 450 with the mold 4060.

(4) According to the electronic apparatus in the fourth embodiment, theabove liquid crystal device 4000 is provided therein, and therefore, itis possible to provide an electronic apparatus capable of improvingdisplay quality and suppressing deterioration in the liquid crystallayer 450.

Modification Example 15

The liquid crystal device 4000 is not limited to the above configurationin which the hook 4072 is arranged, and may be configured of the liquidcrystal panel 40, the mold 4060, and the frame 4071 without arrangingthe hook 4072. In addition, the liquid crystal device 4000 may have aconfiguration in which the first light-transmitting plate 56 and thesecond light-transmitting plate 57 are not included.

Modification Example 16

The invention is not limited to the above configuration in which thesupport seal 4041 is arranged on the second light-transmitting plate 57,any configuration is applicable as long as the mold resin 4060 b doesnot flow into the image display region 40 a, and a passivation film maybe formed into a convex shape, for example.

Modification Example 17

As for electronic apparatuses on which the liquid crystal device 4000 ismounted as described above, it is possible to use the liquid crystaldevice for various electronic apparatuses such as an electrical viewfinder (EVF), a mobile mini projector, a head-up display, a smart phone,a mobile phone, a mobile computer, a digital camera, a digital videocamera, a display, a vehicle-mounted device, an audio device, anexposure device, and an illumination device as well as theprojection-type display apparatus 1.

Modification Example 18

The invention is not limited to the application of the liquid crystaldevice 4000 as the electro-optic device as described above, and theelectro-optic device may be applied to an organic EL device, a plasmadisplay, or an electronic paper (EPD), for example. In a case of aliquid crystal device, for example, an electro-optic material is liquidcrystal. In a case of an electronic paper, the electro-optic material isan electrophoretic material.

Fifth Embodiment

Hereinafter, a fifth embodiment in which an example of the invention isimplemented will be described with reference to drawings. In addition,the drawings to be used are appropriately shown in an enlarged manner orin a contracted manner such that parts to be described can berecognized. Furthermore, since the fifth embodiment is configured in thesame manner as in the first embodiment other than that the configurationof the liquid crystal device 1000 and the method of manufacturing theliquid crystal device as the electro-optic device according to theaforementioned first embodiment are different, the same referencenumerals will be given to the same constituent elements as those in thefirst embodiment, and the descriptions thereof will be omitted.

In this embodiment, a configuration of the electronic apparatus, adetailed configuration of the optical unit, and a configuration of theelectro-optic panel are the same as those according to theaforementioned first embodiment. However, when the liquid crystal panels40(R), 40(G), and 40(B) are mounted on the optical unit 9 shown in FIGS.30 and 31, the liquid crystal panels 40(R), 40(G), and 40(B) are mountedin a state of being provided in liquid crystal devices 5000(R), 5000(G),and 5000(B), which will be described later, respectively.

The liquid crystal panels 40(R), 40(G), and 40(B) have the sameconfiguration, and the liquid crystal devices 5000(R), 5000(G), and5000(B) for the red color (R), the green color (G), and the blue color(B) provided with the liquid panels 40(R), 40(G), and 40(B) also havethe same configuration. Therefore, the following description will begiven without adding (R), (G), and (B) which represent correspondingcolors.

Configuration of Electro-Optic Device

FIG. 32 is a perspective view schematically showing a configuration of aliquid crystal device as the electro-optic device. FIG. 33 is aschematic cross-sectional view taken along line XXXIII-XXXIII in theliquid crystal device shown in FIG. 32. Hereinafter, the configurationof the liquid crystal device will be described with reference to FIGS.32 and 33. In FIG. 33, depiction and description of the flexible wiringsubstrate 90 are omitted.

When the liquid crystal panel 40 described above with reference to FIGS.4A and 4B is mounted on the projection-type display apparatus 1described above with reference to FIGS. 1A, 1B, 30, and 31 and theoptical unit 9, the flexible wiring substrate 90 is connected to theliquid crystal panel 40, and the liquid crystal device 5000 in which amold 5060, a frame 5071, and a hook 5072 are arranged so as to cover theouter circumference of the liquid crystal panel 40 for the purpose ofmoisture resistance and reinforcement is then obtained as shown in FIGS.32 and 33.

As shown in FIGS. 4A, 4B, and 33, the first light-transmitting plate 56is attached to the second surface 51 b of the element substrate 51(outer surface; the surface on the opposite side to the liquid crystallayer 450) with an adhesive agent or the like, and the secondlight-transmitting plate 57 is attached to the second surface 52 b ofthe facing substrate 52 (outer surface; the surface on the opposite sideto the liquid crystal layer 450) with an adhesive agent or the like inthe liquid crystal panel 40.

Since the first light-transmitting plate 56 and the secondlight-transmitting plate 57 have the same configurations as those in theaforementioned first embodiment, the descriptions thereof will beomitted.

The frame 5071 is formed into substantially a concave shape so as tosurround the liquid crystal panel 40 and includes an opening hole at thecenter of the bottom surface thereof. Specifically, a wholecircumference of one end 5071 a which forms the opening hole of theframe 5071 is bent so as to be directed upward with respect to thebottom surface. That is, the whole circumference of the one end 5071 ais arranged so as to be in contact with the surface of the firstlight-transmitting plate 56 on the opposite side to the liquid crystallayer 450 in the liquid crystal panel 40. In addition, the frame 5071 iscaulked or the first light-transmitting plate 56 is bonded to the frame5071 such that mold resin which will be described later does not leakfrom a gap caused at the contact portion between the one end 5071 a andthe first light-transmitting plate 56.

The other end 5071 b of the frame 5071 is arranged so as to extend to anupper position than the upper surface of the second light-transmittingplate 57 of the liquid crystal panel 40 and surround the liquid crystalpanel 40 as a whole. Specifically, a support seal 5041 is arranged onthe upper surface of the second light-transmitting plate 57 so as tosurround the image display region 40 a. The other end 5071 b of theframe 5071 is arranged so as to extend to an upper position than theupper surface of the support seal 5041.

The frame 5071 is configured of a metal material such as aluminum ormagnesium. The frame 5071 is used for forming the mold 5060 and canefficiently release the heat accumulated in the liquid crystal panel 40by being arranged so as to be in contact with the liquid crystal panel40. In addition, since the frame 5071 releases the heat in the liquidcrystal layer 450, it is possible to suppress a decrease in lifetime ofthe liquid crystal layer 450 (lifetime of the liquid crystal panel 40).

The mold 5060 is arranged between the liquid crystal panel 40 and theframe 5071. The mold 5060 is formed of silicon-based resin, for example.The mold 5060 is arranged so as to cover the region from the surface ofthe first light-transmitting plate 56 on the opposite side to the liquidcrystal layer 450 to the surface of the second light-transmitting plate57 on the opposite side to the liquid crystal layer 450.

Specifically, the support seal 5041 is arranged on the surface of thesecond light-transmitting plate 57 so as to surround the image displayregion 40 a as described above. The height position of the upper surfaceof the mold 5060 is arranged so as to be located between the uppersurface and the lower surface of the support seal 5041.

A first resin 5061 is arranged in the mold 5060 in a region where theframe 5071 is opened so as to cover the mold 5060. In other words, thefirst resin 5061 is arranged so as to cover a portion where the mold5060 is exposed. In addition, a second resin 5062 is arranged at acontact portion between the frame 5071 and the first light-transmittingplate 56.

The first resin 5061 and the second resin 5062 are fluorine coatingagents, for example. As the fluorine coating agent, water-shedding resinor resin with low water permeability with respect to moisture isemployed. By arranging (applying) the fluorine coating agent, a statewhere a water entry path is capped is obtained, and entry of moisturefrom the mold 5060 can be suppressed. As a result, it is possible tomaintain responsiveness of the liquid crystal and thereby to improvereliability.

The hook 5072 is placed over the frame 5071 and is fixed thereto with anadhesive agent so as to cover the entire region surrounded by the frame5071. In addition, an opening hole 5072 a which opens in a regionoverlapped with the image display region 40 a is formed in the hook5072. The hook 5072 is arranged on the light incident side and is usedas a parting unit for limiting the range of the light which is incidenton the liquid crystal panel 40.

The hook 5072 is a metal plate, for example. The hook 5072 is made of amaterial with higher heat conductivity than those of the firstlight-transmitting plate 56, the second light-transmitting plate 57, andthe liquid crystal panel 40 (the element substrate 51 and the facingsubstrate 52). More specifically, the hook 5072 is made of metal such asaluminum or copper. In addition, black color treatment is performed onthe surface of the hook 5072 in order to suppress reflection of light.

Since the light-blocking hook 5072 is arranged so as to surround theimage display region 40 a as described above, it is possible to limitthe range of the light which is incident on the image display region 40a. In other words, it is possible to block light which is unnecessarilyincident on the region.

In addition, since the mold 5060 is arranged so as to cover the regionfrom the surface of the first light-transmitting plate 56 on theopposite side to the liquid crystal layer 450 to the surface of thesecond light-transmitting plate 57 on the opposite side to the liquidcrystal layer 450, it is possible to extend the length of the interfacebetween the mold 5060 and the substrates (the element substrate 51, thefacing substrate 52, the first light-transmitting plate 56, and thesecond light-transmitting plate 57). Therefore, it is possible tosuppress entry of moisture into the liquid crystal layer 450 via theinterface and the sealing material 407.

Method of Manufacturing Electro-Optic Device

FIGS. 34A, 34B, and 35A to 35C are cross-sectional views schematicallyshowing a method of manufacturing a liquid crystal device as theelectro-optic device. Particularly, FIGS. 34A, 34B, and 35A to 35C arecross-sectional views schematically showing a method of manufacturing aframe, a mold, and a hook which configure the liquid crystal device.Hereinafter, the method of manufacturing a liquid crystal device will bedescribed with reference to FIGS. 34A, 34B, and 35A to 35C.

In the process shown in FIG. 34A, the support seal 5041 is attached tothe liquid crystal panel 40. Specifically, the support seal 5041 isattached to the upper surface of the second light-transmitting plate 57(the surface on the opposite side to the liquid crystal layer 450) so asto surround the image display region 40 a.

In the process shown in FIG. 34B, the liquid crystal panel 40 isarranged in the frame 5071. Specifically, the liquid crystal panel 40 isarranged on one end 5071 a, which forms the opening hole atsubstantially the center of the frame 5071, of the frame 5071. At thistime, the liquid crystal panel 40 is arranged such that the opening holeof the frame 5071 surrounds the image display region 40 a of the liquidcrystal panel 40 in a plan view.

In the process shown in FIG. 35A, a softened mold resin 5060 b issupplied to a space surrounded by the frame 5071. First, a nozzle 5063for supplying the mold resin 5060 b is arranged between the frame 5071and the liquid crystal panel 40. Then, the mold resin 5060 b is suppliedfrom the nozzle 5063 to the inside of the frame 5071.

The mold resin 5060 b is silicon-based resin, for example, as describedabove. Specifically, it is preferable to use silicon-based resin whichadheres to quartz and is hardened at room temperature. The amount ofmold resin 5060 b is adjusted such that at least the outside of thesupport seal 5041 on the upper surface of the second light-transmittingplate 57 arranged on the facing substrate 52 is buried in the mold resin5060 b. In other words, it is preferable to supply the mold resin 5006 bsuch that the upper surface of the mold 5060 is located between theupper surface and the lower surface of the support seal 5041.

According to this embodiment, the support seal 5041 is arranged on theupper surface of the second light-transmitting plate 57, and therefore,it is possible to cover a part of the upper surface of the secondlight-transmitting plate 57 with the mold resin 5060 b and to preventthe mold resin 5060 b from flowing to the side of the image displayregion 40 a.

By forming the mold 5060 up to a level in which the upper surface of thesecond light-transmitting plate 57 is buried in the mold 5060, it ispossible to extend the length of the interface between the secondlight-transmitting plate 57 and the mold 5060. In other words, it ispossible to extend the length of the distance from a portion of thesecond light-transmitting plate 57, which is in contact with ambientair, to the sealing material 407 and to thereby suppress entry ofmoisture into the liquid crystal layer 450 via the sealing material 407.

In the process shown in FIG. 35B, the first resin 5061 is attached(applied) so as to cover the surface of the mold 5060 between thesupport seal 5041 and the frame 5071. Furthermore, the second resin 5062is attached (applied) so as to cover a portion at which the firstlight-transmitting plate 56 is brought into contact with the frame 5071.

In the process shown in FIG. 35C, the hook 5072 is placed over and fixedto the frame 5071. The opening hole 5072 a is formed at the center ofthe hook 5072 as described above. Therefore, it is possible to limit therange of the light which is incident on the image display region 40 a.

As described above in detail, it is possible to achieve the followingadvantages by the liquid crystal device 5000, the method ofmanufacturing the liquid crystal device 5000, and the electronicapparatus according to this embodiment.

(1) According to the liquid crystal device 5000 in the fifth embodiment,the mold 5060 covers the region in the circumference of the liquidcrystal panel 40 from the surface of the first light-transmitting plate56 on the opposite side to the liquid crystal layer 450 to the surfaceof the second light-transmitting plate 57 on the opposite side to theliquid crystal layer 450, which are surrounded by the frame 5071, andtherefore, it is possible to extend the length of the interface betweenthe liquid crystal panel 40 and the mold 5060. For this reason, it ispossible to suppress entry of moisture into the liquid crystal layer 450via the interface and the sealing material 407.

In addition, since the first resin 5061 is arranged on the surface ofthe mold 5060 in the region where the frame 5071 is opened, in otherwords, on the surface of the exposed mold 5060, it is possible tosuppress entry of moisture into the mold 5060.

In addition, since the second resin 5062 is arranged at the portionwhere the first light-transmitting plate 56 is brought into contact withthe frame 5071, it is possible to suppress entry of moisture into themold 5060. As a result, it is possible to suppress entry of moistureinto the liquid crystal layer 450 via the mold 5060 and the sealingmaterial 407.

(2) According to the method of manufacturing the liquid crystal device5000 in the fifth embodiment, the mold 5060 is supplied between theframe 5071 and the liquid crystal panel 40, and therefore, it ispossible to cover the circumference of the liquid crystal panel 40 withthe mold 5060. Specifically, it is possible to cover the region from thesurface of the first light-transmitting plate 56 on the opposite side tothe liquid crystal layer 450 to the surface of the secondlight-transmitting plate 57 on the opposite side to the liquid crystallayer 450 with the mold 5060. Therefore, it is possible to extend thelength of the interface between the substrates and the mold 5060 and tothereby suppress entry of moisture into the liquid crystal layer 450 viathe interface and the sealing material 407.

In addition, since the first resin 5061 and the second resin 5062 arearranged on the surface of the mold 5060 in the region where the frame5071 is opened, in other words, the surface of the exposed mold 5060 andthe contact portion between the first light-transmitting plate 56 andthe frame 5071, it is possible to suppress entry of moisture into themold 5060. As a result, it is possible to suppress entry of moistureinto the liquid crystal layer 450 via the mold 5060 and the sealingmaterial 407.

(3) According to the electronic apparatus in the fifth embodiment, theabove liquid crystal device 5000 is provided therein, and therefore, itis possible to provide an electronic apparatus capable of improvingdisplay quality and suppressing deterioration in the liquid crystallayer 450.

Modification Example 19

The liquid crystal device 5000 is not limited to the above configurationin which the hook 5072 is arranged, and may be configured of the liquidcrystal panel 40, the mold 5060, and the frame 5071 without arrangingthe hook 5072. In addition, the liquid crystal device 5000 may have aconfiguration in which the first light-transmitting plate 56 and thesecond light-transmitting plate 57 are not included.

Modification Example 20

The invention is not limited to the above configuration in which thesupport seal 5041 is arranged on the second light-transmitting plate 57,any configuration is applicable as long as the mold resin 5060 b doesnot flow into the image display region 40 a, and a passivation film maybe formed into a convex shape, for example.

Modification Example 21

As for electronic apparatuses on which the liquid crystal device 5000 ismounted as described above, it is possible to use the liquid crystaldevice for various electronic apparatuses such as an electrical viewfinder (EVF), a mobile mini projector, a head-up display, a smart phone,a mobile phone, a mobile computer, a digital camera, a digital videocamera, a display, a vehicle-mounted device, an audio device, anexposure device, and an illumination device as well as theprojection-type display apparatus 1.

Modification Example 22

The invention is not limited to the application of the liquid crystaldevice 5000 as the electro-optic device as described above, and theelectro-optic device may be applied to an organic EL device, a plasmadisplay, or an electronic paper (EPD), for example. In a case of aliquid crystal device, for example, an electro-optic material is liquidcrystal. In a case of an electronic paper, the electro-optic material isan electrophoretic material.

Configurations of the invention are not limited to the aforementionedembodiments, and modifications can be appropriately made withoutdeparting from the gist and the idea of the invention described inclaims and the entire specification, which are also included in thetechnical scope of the invention.

The entire disclosure of Japanese Patent Application No. 2013-254759,filed Dec. 10, 2013 and 2013-254760, filed Dec. 10, 2013 and2013-254762, filed Dec. 10, 2013 and 2013-254763, filed Dec. 10, 2013and 2013-254764, filed Dec. 10, 2013 is expressly incorporated byreference herein.

What is claimed is:
 1. An electro-optic device comprising: anelectro-optic panel which includes a first substrate, a second substratearranged so as to face the first substrate with a sealing materialinterposed therebetween, and an electro-optic layer sealed in a regionsurrounded by the sealing material; and a mold which covers an outercircumference of the electro-optic panel and holds the electro-opticpanel, wherein the mold covers a region, which is overlapped with atleast a part of the sealing material in a plan view, from an end of thefirst substrate and an end of the second substrate on a surface of thefirst substrate on an opposite side to the electro-optic layer and asurface of the second substrate on an opposite side to the electro-opticlayer, and wherein a surface of the mold has liquid repellency.
 2. Theelectro-optic device according to claim 1, further comprising: a framebody which is provided so as to be in direct contact with the firstsubstrate or the second substrate or in indirect contact with the firstsubstrate or the second substrate via a third substrate.
 3. Theelectro-optic device according to claim 1, wherein a coating agent withliquid repellency is arranged on the surface of the mold.
 4. Theelectro-optic device according to claim 1, wherein a light-blocking hookwhich includes an opening overlapped with the display region surroundedby the mold is arranged so as to be in contact with the surface of themold.
 5. An electronic apparatus comprising: the electro-optic deviceaccording to claim
 1. 6. An electro-optic device comprising: anelectro-optic panel which includes a first substrate, a second substratearranged so as to face the first substrate with a sealing materialinterposed therebetween, and an electro-optic layer sealed in a regionsurrounded by the sealing material; a mold which covers an outercircumference of the electro-optic panel and holds the electro-opticpanel; a first hook which is arranged between the first substrate andthe mold, includes an opening overlapped with a display region of theelectro-optic panel, and blocks light; and a second hook which isarranged between the second substrate and the mold, includes an openingoverlapped with the display region, and blocks light, wherein the moldcovers a region, which is overlapped with at least a part of the sealingmaterial in a plan view, from an end of the first hook and an end of thesecond hook on a surface of the first hook and a surface of the secondhook.
 7. The electro-optic device according to claim 6, furthercomprising: a third hook which is arranged so as to be in contact with asurface of the mold, includes an opening overlapped with the displayregion, and blocks light.
 8. The electro-optic device according to claim6, further comprising: a third substrate which is provided between thefirst substrate and the first hook and between the second substrate andthe second hook.
 9. The electro-optic device according to claim 6,further comprising: a frame body which is provided so as to be incontact with the first hook or the second hook.
 10. An electro-opticdevice comprising: an electro-optic panel which includes a firstsubstrate, a second substrate arranged so as to face the first substratewith a sealing material interposed therebetween, and an electro-opticlayer sealed in a region surrounded by the sealing material; a moldwhich covers an outer circumference of the electro-optic panel and holdsthe electro-optic panel; a first protection member which is arrangedbetween the first substrate and the mold and includes an openingoverlapped with a display region; and a second protection member whichis arranged between the second substrate and the mold and includes anopening overlapped with the display region, wherein the mold covers aregion, which is overlapped with at least a part of the sealing materialin a plan view, from an end of the first substrate and an end of thesecond substrate on a surface of the first protection member and asurface of the second protection member.
 11. The electro-optic deviceaccording to claim 10, wherein the first protection member is a firstsupport seal, and wherein the second protection member is a secondsupport seal.
 12. The electro-optic device according to claim 11,further comprising: a third substrate which is arranged between thefirst substrate and the first support seal and between the secondsubstrate and the second support seal.
 13. An electro-optic devicecomprising: an electro-optic panel which includes a first substrate, asecond substrate arranged so as to face the first substrate with asealing material interposed therebetween, and an electro-optic layersealed in a region surrounded by the sealing material; a frame which isarranged in a circumference of the electro-optic panel; and a mold whichis arranged between the electro-optic panel and the frame, wherein themold overlaps at least a portion of a first surface of the firstsubstrate on a side of the first substrate opposite to the electro-opticlayer, and the mold overlaps at least a portion of a second surface ofthe second substrate on a side of the second substrate opposite to theelectro-optic layer.
 14. The electro-optic device according to claim 13,wherein a support seal is arranged on the second surface of the secondsubstrate on the side of the second substrate opposite to theelectro-optic layer opposite side to the electro optic layer, andwherein an upper surface of the mold is located between a lower surfaceand an upper surface of the support seal.
 15. The electro-optic deviceaccording to claim 13, wherein a first light-transmitting plate isarranged between the first substrate and the mold, and wherein a secondlight-transmitting plate is arranged between the second substrate andthe mold.
 16. An electro-optic device comprising: an electro-optic panelwhich includes a first substrate, a second substrate arranged so as toface the first substrate with a sealing material interposedtherebetween, and an electro-optic layer sealed in a region surroundedby the sealing material; and a mold which is arranged so as to cover acircumference of the electro-optic panel, wherein the mold overlaps atleast a portion of a first surface of the first substrate on a side ofthe first substrate opposite to the electro-optic layer, and the moldoverlaps at least a portion of a second surface of the second substrateon a side of the second substrate opposite to the electro-optic layer,and first resin is arranged so as to cover the mold.
 17. Theelectro-optic device according to claim 16, further comprising: a framewhich is arranged in a circumference of the electro-optic panel, whereinthe mold is arranged between the electro-optic panel and the frame, andwherein the first resin is arranged so as to cover the mold in a regionwhere the frame is opened.
 18. The electro-optic device according toclaim 17, wherein second resin is arranged so as to cover a portion atwhich the electro-optic panel is in contact with the frame.
 19. Theelectro-optic device according to claim 17, wherein an end of the frameis arranged so as to be in contact with the first surface of the firstsubstrate on the side of the first substrate opposite to theelectro-optic layer, wherein the other end of the frame is arranged at ahigher position than the second surface of the second substrate on theside of the second substrate opposite to the electro-optic layer, andwherein an upper surface of the mold is located between the other end ofthe frame and the second surface of the second substrate on the side ofthe second substrate opposite to the electro-optic layer.
 20. Theelectro-optic device according to claim 17, wherein a hook whichincludes an opening hole in a region overlapped with a display region isarranged so as to be in contact with the frame, and wherein the hookblocks light.
 21. An electro-optic device comprising: an electro-opticpanel which includes a first substrate, a second substrate arranged soas to face the first substrate with a sealing material interposedtherebetween, and an electro-optic layer sealed in a region surroundedby the sealing material; a frame which is arranged in a circumference ofthe electro-optic panel; and a mold which is arranged between theelectro-optic panel and the frame so as to cover a circumference of theelectro-optic panel, wherein the mold covers a region, which isoverlapped with at least a part of the sealing material in a plan view,from an end of the first substrate and an end of the second substrate ona surface of the first substrate on an opposite side to theelectro-optic layer and on a surface of the second substrate on anopposite side to the electro-optic layer, wherein first resin isarranged so as to cover the mold in a region where the frame is opened,and wherein a second resin is arranged so as to cover a portion at whichthe electro-optic panel is in contact with the frame.
 22. Anelectro-optic device comprising: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; a frame which is arranged in a circumference of theelectro-optic panel; and a mold which is arranged between theelectro-optic panel and the frame so as to cover a circumference of theelectro-optic panel, wherein the mold covers a region, which isoverlapped with at least a part of the sealing material in a plan view,from an end of the first substrate and an end of the second substrate ona surface of the first substrate on an opposite side to theelectro-optic layer and on a surface of the second substrate on anopposite side to the electro-optic layer, wherein first resin isarranged so as to cover the mold in a region where the frame is opened,wherein an end of the frame is arranged so as to be in contact with asurface of the first substrate on an opposite side to the electro-opticlayer, wherein an other end of the frame is arranged at a higherposition than a surface of the second substrate on an opposite side ofthe electro-optic layer, and wherein an upper surface of the mold islocated between the other end of the frame and the surface of the secondsubstrate on the opposite side to the electro-optic layer.
 23. Anelectro-optic device comprising: an electro-optic panel which includes afirst substrate, a second substrate arranged so as to face the firstsubstrate with a sealing material interposed therebetween, and anelectro-optic layer sealed in a region surrounded by the sealingmaterial; a frame which is arranged in a circumference of theelectro-optic panel; and a mold which is arranged between theelectro-optic panel and the frame so as to cover a circumference of theelectro-optic panel, wherein the mold covers a region, which isoverlapped with at least a part of the sealing material in a plan view,from an end of the first substrate and an end of the second substrate ona surface of the first substrate on an opposite side to theelectro-optic layer and on a surface of the second substrate on anopposite side to the electro-optic layer, wherein first resin isarranged so as to cover the mold in a region where the frame is opened,wherein a second resin is arranged so as to cover a portion at which theelectro-optic panel is in contact with the frame, wherein a hook whichincludes an opening hole in a region overlapped with a display region isarranged so as to be in contact with the frame, and wherein the hookblocks light.
 24. An electro-optic device comprising: a light modulationpanel that has a first substrate and a second substrate; and a moldwhich covers an outer circumference of the light modulation panel andholds the light modulation panel, wherein the mold covers at least anedge of the first substrate and an edge of the second substrate, and asurface of the mold has liquid repellency.